Semiconductor device with slanted field plate
US-2025120157-A1 · Apr 10, 2025 · US
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Rinck Helmut patents
Rinck Helmut is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Rinck Helmut |
| Total patents | 23 |
| First publication | Jan 5, 2016 |
| Latest publication | Apr 10, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Etching platinum-containing thin film using protective cap layer
US-2024222470-A1 · Jul 4, 2024 · US
Etching platinum-containing thin film using protective cap layer
US-11929423-B2 · Mar 12, 2024 · US
Patterning platinum by alloying and etching platinum alloy
US-2023253211-A1 · Aug 10, 2023 · US
Semiconductor die with dissolvable metal layer
US-2023187390-A1 · Jun 15, 2023 · US
Integrated circuit FLUID sensor
US-2023184713-A1 · Jun 15, 2023 · US
Patterning platinum by alloying and etching platinum alloy
US-11658034-B2 · May 23, 2023 · US
Etching platinum-containing thin film using protective cap layer
US-2021313179-A1 · Oct 7, 2021 · US
Patterning platinum by alloying and etching platinum alloy
US-2021242029-A1 · Aug 5, 2021 · US
Etching platinum-containing thin film using protective cap layer
US-11069530-B2 · Jul 20, 2021 · US
Recent patents
Latest publications not already listed above.
Patterning platinum by alloying and etching platinum alloy
US-11011381-B2 · May 18, 2021 · US
Electronic device having cobalt coated aluminum contact pads
US-10714439-B2 · Jul 14, 2020 · US
Etching platinum-containing thin film using protective cap layer
US-2020083050-A1 · Mar 12, 2020 · US
Patterning platinum by alloying and etching platinum alloy
US-2020035500-A1 · Jan 30, 2020 · US
Etching platinum-containing thin film using protective cap layer
US-10504733-B2 · Dec 10, 2019 · US
Sacrificial layer for platinum patterning
US-10297497-B2 · May 21, 2019 · US
Electronic device having coated contact pads
US-2019109104-A1 · Apr 11, 2019 · US
Metal bond pad with cobalt interconnect layer and solder thereon
US-2018218993-A1 · Aug 2, 2018 · US
Etching platinum-containing thin film using protective cap layer
US-2018204734-A1 · Jul 19, 2018 · US
Sacrificial layer for platinum patterning
US-2018204767-A1 · Jul 19, 2018 · US
Metal bond pad with cobalt interconnect layer and solder thereon
US-9960135-B2 · May 1, 2018 · US
Metal bond pad with cobalt interconnect layer and solder thereon
US-2016284656-A1 · Sep 29, 2016 · US
Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads
US-9230852-B2 · Jan 5, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 22 |
| Texas Instruments Deutschland | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/71 | 14 |
| H10W72/952 | 13 |
| H10W72/923 | 13 |
| H10P50/667 | 12 |
| H10W72/019 | 12 |