Electronic, optoelectronic, or electric arrangement

Patent metadata

Field	Value
Publication number	US-9756717-B2
Application number	US-201414772557-A
Country	US
Kind code	B2
Filing date	Feb 20, 2014
Priority date	Mar 7, 2013
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

An electronic, optoelectronic or electric arrangement contains a circuit carrier having a metallic heat conductor, and a component, which is embedded, inserted or formed in the circuit carrier. The component has at least one electric, electronic or optoelectronic construction element and a rewiring layer, which contains a metallic heat conducting path. A metallic-thermal connection of the rewiring layer and the metallic heat conducting layer of the circuit carrier is provided by the heat conducting path.

First claim

The invention claimed is:

1. A configuration selected from the group consisting of an electronic configuration, an optoelectronic configuration, and an electrical configuration, the configuration comprising:
a circuit carrier having a metallic heat conductor; and
a component embedded or inserted in said circuit carrier, said component having a rewiring layer and at least one structural element selected from the group consisting of an electrical structural element, an electronic structural element and an optoelectronic structural element, said structural element having electrical terminal devices and said rewiring layer configured to enlarge a spacing dimension of said electrical terminal devices for a connection to said circuit carrier, said rewiring layer having a carrier substrate and a metallic heat conducting path, said metallic heat conducting path having a metal track formed on a first main surface of said carrier substrate, and said metallic heat conducting path establishing a metallic-thermal connection of said rewiring layer to said metallic heat conductor of said circuit carrier;
wherein said circuit carrier has a passage opening formed therein, which extends through said carrier substrate;
wherein said metallic heat conductor, or at least a subregion thereof, is formed by an inner wall defining said passage opening; and
wherein said heat conductor is formed by a metallic sleeve inserted into said passage opening.

2. The configuration according to claim 1 , wherein said circuit carrier is a laminated multilayer printed circuit board and said carrier substrate is formed from silicon, aluminum, copper, glass, or a polymer separately from said circuit carrier.

3. The configuration according to claim 1 , wherein:
said rewiring layer has first electrical terminals provided for contacting said electrical terminal devices of said structural element and which overlap with said electrical terminal devices in a top view of said carrier substrate; and
said rewiring layer has second electrical terminals, by which said rewiring layer is connected to said circuit carrier.

4. The configuration according to claim 1 , further comprising a heat sink, wherein a metallic-thermal connection of said rewiring layer to said heat sink is established by means of said metallic heat conducting path.

5. The configuration according to claim 1 , wherein a region of said metallic heat conducting path extends laterally from said structural element toward said metallic heat conductor.

6. The configuration according to claim 5 , wherein said region has a transverse dimension that is at least half as large a transverse dimension as said structural element.

7. The configuration according to claim 1 , wherein said metal track is disposed laterally from said structural element at least at points.

8. The configuration according to claim 1 , wherein:
said rewiring layer has a metal layer, which is disposed on a second main surface of said carrier substrate opposite to said first main surface; and
said metal track is metallically-thermally connected to said metal layer by at least one thermal through contact through said carrier substrate.

9. The configuration according to claim 8 , wherein said rewiring layer has at least one metallic-thermal through contact, which extends from said metal track to said metal layer through said carrier substrate, in a mounting region of said structural element and/or said metallic heat conductor.

10. The configuration according to claim 1 , further comprising through contacts disposed through said circuit carrier, said through contacts connecting parts of said metallic heat conductor disposed on opposite sides of said circuit carrier to one another and extend through said carrier substrate and said metal track.

11. The configuration according to claim 1 , wherein said metallic heat conducting path is formed thicker in a region adjacent to said structural element and/or in a region adjacent to said metallic heat conductor than in a region laterally adjacent thereto.

12. The configuration according to claim 1 , further comprising a mechanical fastening element or an electrical contact device, which is thermally coupled to said metallic heat conductor.

13. The configuration according to claim 1 , wherein said metallic heat conducting path does not fulfill any intended electrical or electronic task or is formed as an electrical ground path.

Assignees

• Continental Automotive Gmbh

Inventors

• Decker Michael
• Riepl Thomas

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H01L2224/48091

  Electricity · mapped topic

• H05K2201/10166

  Transistor · CPC title

• H05K1/0207 Primary

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title