Method for reinforcing conductor tracks of a circuit board

Patent metadata

Field	Value
Publication number	US-10276482-B2
Application number	US-201515504572-A
Country	US
Kind code	B2
Filing date	Aug 25, 2015
Priority date	Aug 28, 2014
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.

First claim

The invention claimed is:

1. A method for producing a circuit carrier for electronic components, the method comprising:
providing a carrier material layer composed of an electrically insulating material having a first surface and a second surface, which is arranged parallel to the first surface, and a connection layer on at least one of the first and second surfaces of the carrier material layer, the connection layer having a predefined layer thickness and including a plurality of electrically conductive connections with a predefined conductor track width;
reinforcing at least some of the connections, at least in sections thereof, by plasma spraying with additional electrically conductive material, to form reinforced connections, at least in sections thereof, with a conductor track width that is greater than the predefined conductor track width; and
thereby applying the additional material at least in places areally on a soldering resist or directly on the carrier material layer.

2. The method according to claim 1 , wherein the step of providing the carrier material layer with the connection layer comprises providing a standard circuit board with the electrical connections, and the reinforcing step comprises subsequently applying additional material on some of the connections of the standard circuit board.

3. The method according to claim 1 , wherein the step of providing the carrier material layer with the said connection layer comprises the following steps:
providing a first ply composed of the electrically insulating material, and a further connection layer of a predefined layer thickness on the first ply;
reinforcing the further connection layer, at least in sections thereof, with the additional electrically conductive material by plasma spraying, to obtain a layer thickness greater than the predefined layer thickness;
providing a second ply composed of the electrically insulating material;
joining together the first ply and the second ply, to thereby arrange the further connection layer internally inside the carrier material layer; and
applying the said connection layer; and
forming the further connection layer in such a way that the further connection layer occupies an area region of the circuit carrier which is arranged underneath a component in a direction orthogonally to the first or second surface, and the area region is reinforced by the plasma spraying at least in section with the additional electrically conductive material.

4. The method according to claim 1 , which comprises applying a metal selected from the group consisting of copper, aluminum and bronze as additional electrically conductive material during the plasma spraying.

5. The method according to claim 1 , which comprises applying the additional material areally on the soldering resist, with the soldering resist covering the connection layer arranged on the first and/or the second surface.

6. The method according to claim 1 , which comprises forming the reinforced connections with a layer thickness that is greater than the predefined layer thickness.

Assignees

• Continental Automotive Gmbh

Inventors

• Bagung Detlev
• Riepl Thomas

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title