Metal component including an intermetallic compound layer and method for manufacturing thereof
US-2025257469-A1 · Aug 14, 2025 · US
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Pok Pei Luan patents
Pok Pei Luan is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Pok Pei Luan |
| Total patents | 8 |
| First publication | Jun 21, 2018 |
| Latest publication | Aug 14, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Subtractive Metal Structuring on Surface of Semiconductor Package
US-2024312956-A1 · Sep 19, 2024 · US
Dual step laser processing of an encapsulant of a semiconductor chip package
US-11791169-B2 · Oct 17, 2023 · US
Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package
US-2021050227-A1 · Feb 18, 2021 · US
Semiconductor package with air cavity
US-10777536-B2 · Sep 15, 2020 · US
Semiconductor package and method for fabricating a semiconductor package
US-10490470-B2 · Nov 26, 2019 · US
Semiconductor Package with Air Cavity
US-2019181120-A1 · Jun 13, 2019 · US
Semiconductor package and method for fabricating a semiconductor package
US-2018174935-A1 · Jun 21, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 6 |
| H10W74/01 | 5 |
| H10W74/00 | 4 |
| H10W74/15 | 4 |
| H10W90/724 | 4 |