Resist patterned redistribution wiring on copper polyimide via layer
US-12469787-B2 · Nov 11, 2025 · US
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Perfecto Eric patents
Perfecto Eric is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Perfecto Eric |
| Total patents | 8 |
| First publication | Oct 8, 2019 |
| Latest publication | Nov 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Structure for monitoring hybrid bonds in a semiconductor chip package
US-2025201638-A1 · Jun 19, 2025 · US
Infrared debond damage mitigation by copper fill pattern
US-12300615-B2 · May 13, 2025 · US
Hybrid bond integration for multi-die assembly
US-2024332239-A1 · Oct 3, 2024 · US
Infrared debond damage mitigation by copper fill pattern
US-2024170288-A1 · May 23, 2024 · US
Structure for hybrid bond crackstop with airgaps
US-2024113055-A1 · Apr 4, 2024 · US
Resist patterned redistribution wiring on copper polyimide via layer
US-2023268275-A1 · Aug 24, 2023 · US
Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices
US-10438894-B1 · Oct 8, 2019 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 7 |
| Globalfoundries Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/90 | 5 |
| H10W72/019 | 4 |
| H10W90/00 | 4 |
| H10W90/724 | 3 |
| H10W90/792 | 3 |