Layered process-constructed double-winding embedded solenoid inductor
US-2025166881-A1 · May 22, 2025 · US
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Patten David patents
Patten David is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Patten David |
| Total patents | 23 |
| First publication | May 10, 2018 |
| Latest publication | May 22, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for constructing a solenoid inductor
US-12217898-B2 · Feb 4, 2025 · US
Layered process-constructed double-winding embedded solenoid inductor
US-2024136105-A1 · Apr 25, 2024 · US
Electronic circuit fabrication
US-2024128235-A1 · Apr 18, 2024 · US
Symmetric layout for high-voltage amplifier
US-11942468-B2 · Mar 26, 2024 · US
Layered process-constructed double-winding embedded solenoid inductor
US-11881343-B2 · Jan 23, 2024 · US
Symmetric layout for high-voltage amplifier
US-2022384413-A1 · Dec 1, 2022 · US
Integrated circuits with embedded layers
US-2022376035-A1 · Nov 24, 2022 · US
Packaging for MEMS transducers
US-11299392-B2 · Apr 12, 2022 · US
Packaging for a MEMS transducer
US-11252513-B2 · Feb 15, 2022 · US
Recent patents
Latest publications not already listed above.
Layered process-constructed double-winding embedded solenoid inductor
US-2021287841-A1 · Sep 16, 2021 · US
Conformal shield for blocking light in an integrated circuit package
US-2021111131-A1 · Apr 15, 2021 · US
Packaging for mems transducers
US-2020377363-A1 · Dec 3, 2020 · US
Packaging for a mems transducer
US-2020369514-A1 · Nov 26, 2020 · US
Packaging for a mems transducer
US-2020304921-A1 · Sep 24, 2020 · US
MEMS packaging
US-10735868-B2 · Aug 4, 2020 · US
Transducer packaging
US-10696545-B2 · Jun 30, 2020 · US
MEMS transducer package
US-10469956-B2 · Nov 5, 2019 · US
Mems packaging
US-2019158962-A1 · May 23, 2019 · US
Package for MEMS device and process
US-10252906-B2 · Apr 9, 2019 · US
Transducer packaging
US-2018362332-A1 · Dec 20, 2018 · US
MEMS Transducer Package
US-2018279057-A1 · Sep 27, 2018 · US
Package for mems device and process
US-2018127265-A1 · May 10, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Cirrus Logic Int Semiconductor Ltd | 23 |
| Cirrus Logic Inc | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B81B2201/0257 | 13 |
| H04R2201/003 | 11 |
| B81B2207/012 | 11 |
| H04R19/04 | 10 |
| H04R19/005 | 9 |