Package for MEMS device and process

Patent metadata

Field	Value
Publication number	US-10252906-B2
Application number	US-201715788499-A
Country	US
Kind code	B2
Filing date	Oct 19, 2017
Priority date	Nov 7, 2016
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.

First claim

The invention claimed is:

1. A package for a MEMS transducer comprising:
a first member;
a second member provided in a plane overlying the first member;
a chamber provided between the first and second members;
a third member interposed between the first and second members, wherein the third member comprises a cavity which extends through the plane of the third member and forms part of the chamber,
wherein an integrated circuit is provided within the chamber of the package and is mounted on the first member, an electrically conductive path being provided directly between the integrated circuit and an electrical contact provided on an upper region of the third member,
and wherein the package comprises a metallic lid structure between the first member and the third member, the lid structure comprising side portions and an upper surface portion, the side portions are mounted to the first member and the upper surface portion forms a layer of the third member, the upper surface portion comprising a lid-cavity which forms at least part of the cavity of the third member.

2. A package as claimed in claim 1 , wherein the electrically conductive path is provided by wire bonding between the integrated circuit and the electrical contact.

3. A package as claimed in claim 1 , wherein the third member at least partially forms a side-wall of the package.

4. A package as claimed in claim 3 , wherein the package comprises a side-wall recess formed between the first member and the third member.

5. A package as claimed in claim 4 , wherein at least a part of the integrated circuit is provided within the side wall recess.

6. A package as claimed in claim 1 , wherein one or more of the first member, the second member and the third member comprise a core of one or more of PCB, FR-4 board, silicon or plastic.

7. A package as claimed in claim 6 , wherein one or more of the first member, the second member and the third member further comprises one or more additional layers provided on an upper and/or lower surface of the core.

8. A package as claimed in claim 7 , wherein one of the additional layers comprises an insulating layer or a solder mask layer.

9. A package as claimed in claim 7 , wherein the first member comprises a core and an additional layer provided on a first region of the upper surface of the core, wherein the additional layer is not provided on a second region of the upper surface of the first member and wherein the integrated circuit is mounted to the first member in the second region and is mounted directly on the core of the first member.

10. A package as claimed in claim 7 , wherein the third member comprises a core and an additional layer provided on a first region of a lower surface of the core wherein said additional layer is not provided on a second region of the lower surface thereof, which second region is in a plane below the electrical contact.

11. A package as claimed in claim 1 , wherein the second member is provided with an external electrical contact on an outer surface thereof.

12. A package as claimed in claim 1 , wherein the second member is provided with a via for electrically coupling the electrical contact provided on the upper region of the third member and the external electrical contact of the package.

13. A package as claimed in claim 1 , wherein the first and third members and/or the third and second members are bonded together by means of solder bonds.

14. A package as claimed in claim 1 , further comprising a MEMS transducer provided within the chamber said MEMS transducer comprising a flexible membrane and being provided such that the flexible membrane overlies a sound port of the first member.

15. A package as claimed in claim 14 , wherein the sound port couples to a first volume provided beneath the flexible membrane and wherein a second volume is defined on the other side of the flexible membrane.

16. An electronic device comprising a package as claimed in claim 1 , wherein said electronic device is at least one of: a portable device; a battery power device; a computing device; a communications device; a gaming device; a mobile telephone; an earphone or in-ear hearing aid, a personal media player; a laptop, tablet or notebook computing device.

17. A package for a MEMS transducer comprising:
a first member;
a second member provided in a plane overlying the first member;
a chamber provided between the first and second members;
a third member interposed between the first and second members, the third member at least partially forming a side-wall of the package, wherein the third member comprises an intermediate cavity which extends through the plane of the third member and forms part of the chamber,
wherein an integrated circuit is provided within the chamber and is mounted on the first member, wherein the package comprises a side-wall recess formed between the first member and the third member and an integrated circuit, and wherein at least a part of the integrated circuit is provided within the side-wall recess,
and wherein the package comprises a metallic lid structure between the first member and the third member, the lid structure comprising side portions and an upper surface portion, the side portions are mounted to the first member and the upper surface portion forms a layer of the third member, the upper surface portion comprising a lid-cavity which forms at least part of the intermediate cavity of the third member.

18. A package as claimed in claim 17 , wherein an electrically conductive path is provided directly between the integrated circuit and an electrical contact provided on an upper region of the third member.

19. A package as claimed in claim 18 , wherein the electrically conductive path is provided by wire bonding between the integrated circuit and the electrical contact.

20. A package as claimed in claim 19 , wherein no electrically conductive path is provided between the integrated circuit and an external electrical contact through the third member that forms the side wall.

Assignees

• Cirrus Logic Int Semiconductor Ltd
• Cirrus Logic Inc

Inventors

• Brioschi Roberto
• Patten David
• Achehboune Rkia

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/50

  Bond wires · CPC title