Automated cmp pad change for cmp system
US-2026048474-A1 · Feb 19, 2026 · US
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Pang Benedict W patents
Pang Benedict W is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Pang Benedict W |
| Total patents | 6 |
| First publication | Jan 26, 2023 |
| Latest publication | Feb 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer
US-12257664-B2 · Mar 25, 2025 · US
Face-up wafer electrochemical planarization apparatus
US-2025001547-A1 · Jan 2, 2025 · US
Face-up wafer electrochemical planarization apparatus
US-12090600-B2 · Sep 17, 2024 · US
Face-up wafer electrochemical planarization apparatus
US-2023390887-A1 · Dec 7, 2023 · US
Face-up wafer edge polishing apparatus
US-2023024009-A1 · Jan 26, 2023 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B24B37/32 | 4 |
| H10P95/062 | 3 |
| H10P52/203 | 3 |
| C25F3/30 | 3 |
| C25F7/00 | 3 |