Methods and systems for high power thermally stable small heat pipes
US-2026096061-A1 · Apr 2, 2026 · US
This page is not indexed by search engines while we improve data quality.
Nikkhoo Michael patents
Nikkhoo Michael is listed as an inventor on 83 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nikkhoo Michael |
| Total patents | 83 |
| First publication | Jan 13, 2015 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Thermal conduit for electronic device
US-2025380387-A1 · Dec 11, 2025 · US
Heat pipe including an integrated antenna
US-12453050-B1 · Oct 21, 2025 · US
Flexible hinge thermal architecture
US-2025264917-A1 · Aug 21, 2025 · US
Systems and methods for controlling thermal energy between hinged portions of electronic devices
US-12393052-B1 · Aug 19, 2025 · US
Thermal conduit for electronic device
US-12328845-B2 · Jun 10, 2025 · US
Stack-PCB architecture with embedded vapor chamber
US-12317408-B2 · May 27, 2025 · US
Systems and methods for three-dimensional heat transfer architectures manufactured by selective plating
US-2025126751-A1 · Apr 17, 2025 · US
Glass fiber heat pipes and wicks for heat pipes
US-2024361085-A1 · Oct 31, 2024 · US
Thermal interposer for electronic device
US-12108576-B1 · Oct 1, 2024 · US
Recent patents
Latest publications not already listed above.
Polygonal-shaped heat pipes
US-2024318924-A1 · Sep 26, 2024 · US
Thermal hinge system
US-12032171-B1 · Jul 9, 2024 · US
Thermal interface material for electronic device
US-11991870-B1 · May 21, 2024 · US
Thermoplastic interposer
US-2024121882-A1 · Apr 11, 2024 · US
Stack-pcb architecture with embedded vapor chamber
US-2024098877-A1 · Mar 21, 2024 · US
Heat pipes and vapor chambers manufactured using a vacuum process
US-2024077259-A1 · Mar 7, 2024 · US
Stack-PCB design and midplane architecture
US-11839054-B1 · Dec 5, 2023 · US
Ultra-high molecular weight polyethylene multilayers for vr/ar/mr thermal management
US-2023354566-A1 · Nov 2, 2023 · US
Sealing a heat pipe
US-11796258-B2 · Oct 24, 2023 · US
Flexible thermal system
US-2023309265-A1 · Sep 28, 2023 · US
Thermal conduit for electronic device
US-2023200019-A1 · Jun 22, 2023 · US
Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid
US-11397055-B2 · Jul 26, 2022 · US
Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same
US-11304334-B2 · Apr 12, 2022 · US
Fit system using collapsible beams for wearable articles
US-11150694-B2 · Oct 19, 2021 · US
Formable interface and shielding structures
US-11125513-B2 · Sep 21, 2021 · US
Two-Phase Thermodynamic System Having a Porous Microstructure Sheet with Varying Surface Energy to Optimize Utilization of a Working Fluid
US-2021207893-A1 · Jul 8, 2021 · US
Support assembly pad shape for providing universal fitting head-mounted display devices
US-10989919-B2 · Apr 27, 2021 · US
Sealing a heat pipe
US-2021116185-A1 · Apr 22, 2021 · US
Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid
US-10962298-B2 · Mar 30, 2021 · US
Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid
US-10935325-B2 · Mar 2, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Microsoft Technology Licensing Llc | 61 |
| Meta Platforms Tech Llc | 18 |
| Nikkhoo Michael | 2 |
| Apple Inc | 2 |
| Meta Platforms Tech Llc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B27/0176 | 29 |
| G06F1/163 | 23 |
| G06F1/203 | 16 |
| G02B2027/0178 | 14 |
| Y02P70/50 | 14 |