Heat pipe including an integrated antenna

Patent metadata

Field	Value
Publication number	US-12453050-B1
Application number	US-202218071387-A
Country	US
Kind code	B1
Filing date	Nov 29, 2022
Priority date	Nov 29, 2022
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

A polyimide-based heat pipe is described. In examples, the heat pipe may include a first substrate including raised features on a surface of the substrate. In examples, the first substrate is covered with a second substrate or cover. At least the second substrate comprises polyimide. An outer surface of the heat pipe, e.g., the second substrate, includes one or more antennas disposed thereon.

First claim

What is claimed is:

1. A wearable device comprising at least one heat pipe, wherein the at least one heat pipe comprises:
a first substrate comprising a plurality of raised features configured to form groups of channels separated by spacers on a surface of the first substrate;
an evaporator portion;
a condenser portion formed over the groups of channels;
a second substrate bonded to the first substrate;
a working fluid between the first substrate and the second substrate; and
an antenna disposed on an outer surface of one of the first substrate or the second substrate,
wherein the antenna comprises a linear antenna, and wherein at least one of the first substrate or the second substrate comprises polyimide.

2. The wearable device of claim 1 , further comprising: a dielectric material on the at least one heat pipe, wherein the antenna is disposed on the dielectric material.

3. The wearable device of claim 2 , wherein the dielectric material comprises polythene.

4. The wearable device of claim 2 , wherein the dielectric material comprises polypropylene.

5. The wearable device of claim 1 , wherein the antenna comprises: a radio frequency (RF) compatible thin film.

6. The wearable device of claim 1 , further comprising:
one or more stiffening layers on portions of the at least one heat Pipe,
wherein the antenna is disposed on the one or more stiffening layers.

7. The wearable device of claim 6 , wherein the one or more stiffening layers comprise polythene.

8. The wearable device of claim 6 , wherein the one or more stiffening layers comprise polypropylene.

9. A heat pipe comprising:
a first substrate comprising a plurality of raised features configured to form groups of channels separated by spacers on a surface of the first substrate;
an evaporator portion;
a condenser portion formed over the groups of channels;
a second substrate bonded to the first substrate;
a working fluid between the first substrate and the second substrate; and
an antenna disposed on an outer surface of one of the first substrate or the second substrate,
wherein at least one of the first substrate or the second substrate comprises polyimide.

10. The heat pipe of claim 9 , further comprising:
a dielectric material on the heat pipe, wherein the antenna is disposed on the dielectric material.

11. The heat pipe of claim 10 , wherein the dielectric material comprises polythene.

12. The heat pipe of claim 10 , wherein the dielectric material comprises polypropylene.

13. The heat pipe of claim 9 , wherein the antenna comprises: a radio frequency (RF) compatible thin film.

14. The heat pipe of claim 9 , further comprising:
one or more stiffening layers on portions of the heat pipe,
wherein the antenna is disposed on the one or more stiffening layers.

15. A heat dissipating apparatus comprising:
a first substrate comprising a plurality of raised features configured to form channels on a surface of the first substrate;
an evaporator portion;
a condenser portion;
a second substrate bonded to the first substrate;
a working fluid between the first substrate and the second substrate; and
an antenna disposed on an outer surface of one of the first substrate or the second substrate,
wherein the antenna comprises a linear antenna, and wherein at least one of the first substrate or the second substrate comprises polyimide.

16. The heat dissipating apparatus of claim 15 , further comprising:
a dielectric material on the heat dissipating apparatus, wherein the antenna is disposed on the dielectric material.

17. The heat dissipating apparatus of claim 16 , wherein the dielectric material comprises polythene.

18. The heat dissipating apparatus of claim 16 , wherein the dielectric material comprises polypropylene.

19. The heat dissipating apparatus of claim 15 , wherein the antenna comprises:
a radio frequency (RF) compatible thin film.

20. The heat dissipating apparatus of claim 15 , further comprising:
one or more stiffening layers on portions of the heat dissipating apparatus,
wherein the antenna is disposed on the one or more stiffening layers.

Assignees

• Meta Platforms Tech Llc

Inventors

• Nikkhoo Michael
• SAHU Vivek
• Toleno Brian

Classifications

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• H05K7/20309

  Evaporators · CPC title

• H05K7/20318

  Condensers · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title