Thermal conduit for electronic device

Patent metadata

Field	Value
Publication number	US-12328845-B2
Application number	US-202117556719-A
Country	US
Kind code	B2
Filing date	Dec 20, 2021
Priority date	Dec 20, 2021
Publication date	Jun 10, 2025
Grant date	Jun 10, 2025

Abstract

A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over at least a portion of the first material and the second material such that the thermally conductive silicone forms the first end and the second end of the thermal conduit. The thermal conduit may be used in electronic device, such as a wearable device, to transmit heat from a heat source (e.g., a processor) to a thermal ground (e.g., a housing).

First claim

What is claimed is:

1. A wearable device comprising:
a housing;
an electronic component disposed within the housing; and
a thermal conduit disposed within the housing such that a first end of the thermal conduit is disposed in thermal contact with the electronic component and a second end of the thermal conduit is disposed in thermal contact with the housing, wherein the thermal conduit includes:
a first material forming a core of the thermal conduit, the first material extending along an axial length of the thermal conduit,
a second material coating at least a portion of the first material and extending along at least a portion of the axial length of the thermal conduit,
a first thermally conductive silicone defining a first end of the thermal conduit, wherein the first thermally conductive silicone is disposed over a perimeter of a first end of the first material and the second material and is in direct contact with a first end portion of a top surface of the first material and a corresponding first end portion of a top surface of the second material, and
a second thermally conductive silicone defining a second end of the thermal conduit, opposite the first end of the thermal conduit, wherein the second thermally conductive silicone is disposed over a perimeter of a second end of the first material and the second material and is in direct contact with a second end portion of the top surface of the first material and a corresponding second end portion of the top surface of the second material.

2. The wearable device of claim 1 , wherein the first material and the second material form a flexible portion of the thermal conduit.

3. The wearable device of claim 1 , wherein the first material comprises pyrolytic graphite and the second material comprises copper or polyethylene terephthalate.

4. The wearable device of claim 1 , wherein the first thermally conductive silicone and second thermally conductive silicone are compressible.

5. The wearable device of claim 1 , wherein the first thermally conductive silicone defining the first end of the thermal conduit is coupled to the electronic component and the second thermally conductive silicone defining the second end of the thermal conduit is coupled to the housing.

6. The wearable device of claim 1 , wherein the first material has a thickness between approximately 25 microns and 175 microns.

7. The wearable device of claim 1 , wherein the first material and the second material form a thermal pathway and the thermal pathway has a thickness between approximately 35 microns and approximately 195 microns.

8. The wearable device of claim 1 , wherein the first material includes thermal conductivity of at least 900 W/m-K.

9. The wearable device of claim 1 , wherein the second material is bonded to the first material via a pressure sensitive adhesive.

10. An electronic device comprising:
an electronic component;
a thermal ground; and
a flexible thermal conduit having a first end coupled to the electronic component and a second end coupled to the thermal ground, such that the thermal conduit draws thermal energy from the electronic component and transfers the thermal energy to the thermal ground, wherein the thermal conduit includes:
a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity,
a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity,
a first thermally conductive silicone defining a first end of the thermal conduit, wherein the first thermally conductive silicone is disposed over a perimeter of a first end of the first material and the second material and is in direct contact with a first end portion of a top surface of the first material and a corresponding first end portion of a top surface of the second material, and
a second thermally conductive silicone defining a second end of the thermal conduit, opposite the first end of the thermal conduit, wherein the second thermally conductive silicone is disposed over a perimeter of a second end of the first material and the second material and is in direct contact with a second end portion of the top surface of the first material and a corresponding second end portion of the top surface of the second material.

11. The electronic device of claim 10 , wherein the thermal ground comprises a housing of the electronic device.

12. The electronic device of claim 10 , wherein the first thermally conductive silicone defining the first end of the thermal conduit is coupled to the electronic component and the second thermally conductive silicone defining the second end of the thermal conduit is coupled to the thermal ground.

13. The electronic device of claim 10 , wherein the second material is bonded to the first material via a pressure sensitive adhesive.

14. The electronic device of claim 10 , wherein the first thermally conductive silicone and the second thermally conductive silicone adheres more strongly to the second material than the first material.

15. The electronic device of claim 10 , wherein the first material comprises pyrolytic graphite and the second material comprises copper or polyethylene terephthalate.

16. The electronic device of claim 10 , wherein the second material is wetted to the first material to bond the second material to the first material.

17. A thermal conduit comprising:
a thermal pathway having a first end and a second end, the thermal pathway including:
a first material extending along an axial length of the thermal pathway of the thermal conduit, the first material having a first thermal conductivity,
a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity,
a first thermally conductive silicone defining a first end of the thermal conduit, wherein the first thermally conductive silicone is disposed over a perimeter of a first end of the first material and the second material and is in direct contact with a first end portion of a top surface of the first material and a corresponding first end portion of a top surface of the second material, and
a second thermally conductive silicone defining a second end of the thermal conduit, opposite the first end of the thermal conduit, wherein the second thermally conductive silicone is disposed over a perimeter of a second end of the first material and the second material and is in direct contact with a second end portion of the top surface of that the first material and a corresponding second end portion of the top surface of the second material.

18. The thermal conduit of claim 17 , wherein the first material comprises pyrolytic graphite and the second material comprises copper or polyethylene terephthalate.

19. The thermal conduit of claim 17 , wherein the thermal pathway is flexible and the first thermally conductive silicone is coupled to a first component and the second thermally conductive silicone is coupled to a second component such that the thermal conduit draws thermal energy from the first component and transfers the thermal energy to the second component.

20. The electronic device of claim 10 , wherein a length of the first material is configured to extend beyond an entire length of the second material.

Assignees

• Meta Platforms Tech Llc

Inventors

• Nikkhoo Michael
• Toleno Brian

Classifications

• H10W40/25

  characterised by their materials · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• H05K7/20472

  Sheet interfaces · CPC title

• H05K7/20445

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• F28F21/02

  of carbon, e.g. graphite · CPC title