Printed circuit board
US-11737210-B2 · Aug 22, 2023 · US
This page is not indexed by search engines while we improve data quality.
Mun Seong Jae patents
Mun Seong Jae is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mun Seong Jae |
| Total patents | 6 |
| First publication | Nov 3, 2020 |
| Latest publication | Aug 22, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Printed circuit board
US-2022030713-A1 · Jan 27, 2022 · US
Method for plating printed circuit board and printed circuit board using the same
US-2021329794-A1 · Oct 21, 2021 · US
Method for plating printed circuit board and printed circuit board using the same
US-11096291-B2 · Aug 17, 2021 · US
Method for plating printed circuit board and printed circuit board using the same
US-2020413548-A1 · Dec 31, 2020 · US
Printed circuit board
US-10827615-B1 · Nov 3, 2020 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/115 | 6 |
| H05K1/0206 | 6 |
| H05K2203/1476 | 6 |
| H05K1/113 | 5 |
| H05K3/423 | 5 |