Method for assembling components implementing a pre-treatment of the solder bumps allowing an assembly by fluxless and residue-free soldering
US-11855038-B2 · Dec 26, 2023 · US
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Miloud-Ali Nadia patents
Miloud-Ali Nadia is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Miloud-Ali Nadia |
| Total patents | 3 |
| First publication | Jul 25, 2017 |
| Latest publication | Dec 26, 2023 |
Notable patents
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Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Commissariat Energie Atomique | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/722 | 2 |
| H10W72/07236 | 2 |
| H10W72/07211 | 2 |
| H10W72/01271 | 2 |
| H10W72/255 | 2 |