Clamped semiconductor wafers and semiconductor devices
US-12224259-B2 · Feb 11, 2025 · US
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Linnen Daniel patents
Linnen Daniel is listed as an inventor on 37 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Linnen Daniel |
| Total patents | 37 |
| First publication | Dec 6, 2018 |
| Latest publication | Feb 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Data storage device adaptor with securement mechanism
US-12096583-B2 · Sep 17, 2024 · US
Data storage device with data verification circuitry
US-11836035-B2 · Dec 5, 2023 · US
Clamped semiconductor wafers and semiconductor devices
US-2023326887-A1 · Oct 12, 2023 · US
Voltage sharing across memory dies in response to a charge pump failure
US-11776637-B2 · Oct 3, 2023 · US
Voltage sharing across memory dies in response to a charge pump failure
US-2023245705-A1 · Aug 3, 2023 · US
System and method for warpage detection in a CMOS bonded array
US-11682595-B2 · Jun 20, 2023 · US
Data storage device adaptor with securement mechanism
US-2023180417-A1 · Jun 8, 2023 · US
Data storage device with data verification circuitry
US-2023039071-A1 · Feb 9, 2023 · US
Data storage device adaptor with securement mechanism
US-11570924-B2 · Jan 31, 2023 · US
Recent patents
Latest publications not already listed above.
Non-volatile storage with processive writes
US-11482292-B1 · Oct 25, 2022 · US
Semiconductor device including coupled bond pads having differing numbers of pad legs
US-11462497-B2 · Oct 4, 2022 · US
Straight wirebonding of silicon dies
US-11456272-B2 · Sep 27, 2022 · US
System and method for die crack detection in a CMOS bonded array
US-11450575-B2 · Sep 20, 2022 · US
Semiconductor device including coupled bond pads having differing numbers of pad legs
US-2022115343-A1 · Apr 14, 2022 · US
System and Method for Die Crack Detection in a CMOS Bonded Array
US-2022108926-A1 · Apr 7, 2022 · US
System and Method for Warpage Detection in a CMOS Bonded Array
US-2022093476-A1 · Mar 24, 2022 · US
Straight wirebonding of silicon dies
US-2022084979-A1 · Mar 17, 2022 · US
Semiconductor device including vertical bond pads
US-11222865-B2 · Jan 11, 2022 · US
Semiconductor device including fractured semiconductor dies
US-11195820-B2 · Dec 7, 2021 · US
Semiconductor device including vertical bond pads
US-2021358886-A1 · Nov 18, 2021 · US
Semiconductor device including fractured semiconductor dies
US-2021280559-A1 · Sep 9, 2021 · US
Data storage device adaptor with securement mechanism
US-2021267083-A1 · Aug 26, 2021 · US
Data storage device with dynamic stripe length manager
US-2021191796-A1 · Jun 24, 2021 · US
Data storage device with dynamic stripe length manager
US-11042432-B1 · Jun 22, 2021 · US
Ssd system using power-cycle based read scrub
US-2021149800-A1 · May 20, 2021 · US
Non-volatile storage system with program failure recovery
US-11003551-B2 · May 11, 2021 · US
Clock frequency counting during high-voltage operations for immediate leakage detection and response
US-10991447-B2 · Apr 27, 2021 · US
Different word line programming orders in non-volatile memory for error recovery
US-10943662-B1 · Mar 9, 2021 · US
NAND field use erase plus defect detections
US-10886002-B1 · Jan 5, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Western Digital Tech Inc | 25 |
| Sandisk Technologies Llc | 12 |
| Sandisk Technologies Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G11C16/0483 | 14 |
| H10W72/90 | 10 |
| G11C16/10 | 10 |
| G06F3/0679 | 9 |
| H10W90/752 | 8 |