Methods of forming semiconductor devices
US-12563818-B2 · Feb 24, 2026 · US
Lin Jui-Ping is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin Jui-Ping |
| Total patents | 17 |
| First publication | Mar 29, 2022 |
| Latest publication | Feb 24, 2026 |
Publications ranked by popularity score, then publication date.
US-12563818-B2 · Feb 24, 2026 · US
US-2025349546-A1 · Nov 13, 2025 · US
US-2025267921-A1 · Aug 21, 2025 · US
US-2025107196-A1 · Mar 27, 2025 · US
US-2025087491-A1 · Mar 13, 2025 · US
US-12191151-B2 · Jan 7, 2025 · US
US-12166088-B2 · Dec 10, 2024 · US
US-2024266228-A1 · Aug 8, 2024 · US
US-11990378-B2 · May 21, 2024 · US
US-2023230885-A1 · Jul 20, 2023 · US
Latest publications not already listed above.
US-11615991-B2 · Mar 28, 2023 · US
US-2023061857-A1 · Mar 2, 2023 · US
US-2022336592-A1 · Oct 20, 2022 · US
US-2022310398-A1 · Sep 29, 2022 · US
US-11387331-B2 · Jul 12, 2022 · US
US-2022216111-A1 · Jul 7, 2022 · US
US-11289383-B2 · Mar 29, 2022 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 20 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/038 | 17 |
| H10D84/0149 | 16 |
| H10D84/0158 | 15 |
| H10D84/017 | 12 |
| H10D84/0186 | 12 |