Semiconductor structure and method for forming the same
US-2024387254-A1 · Nov 21, 2024 · US
Lin Da-Wei is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin Da-Wei |
| Total patents | 12 |
| First publication | Oct 8, 2015 |
| Latest publication | Nov 21, 2024 |
Publications ranked by popularity score, then publication date.
US-2024387254-A1 · Nov 21, 2024 · US
US-12148657-B2 · Nov 19, 2024 · US
US-2024332069-A1 · Oct 3, 2024 · US
US-11615983-B2 · Mar 28, 2023 · US
US-2022367253-A1 · Nov 17, 2022 · US
US-2021335661-A1 · Oct 28, 2021 · US
US-10290535-B1 · May 14, 2019 · US
US-9240518-B2 · Jan 19, 2016 · US
US-2016011343-A1 · Jan 14, 2016 · US
US-9170352-B2 · Oct 27, 2015 · US
Latest publications not already listed above.
US-2015287881-A1 · Oct 8, 2015 · US
US-2015287879-A1 · Oct 8, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 7 |
| Univ Nat Chiao Tung | 3 |
| Hon Hai Prec Ind Co Ltd | 2 |
| Lin Da-Wei | 1 |
| Yu Tai-Cherng | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/056 | 7 |
| H10W20/42 | 6 |
| H10W20/43 | 6 |
| H01L23/5226 | 6 |
| H01L21/76877 | 6 |