Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulant
US-11817418-B2 · Nov 14, 2023 · US
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Lim Wei Lee patents
Lim Wei Lee is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lim Wei Lee |
| Total patents | 3 |
| First publication | Feb 6, 2020 |
| Latest publication | Nov 14, 2023 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/354 | 3 |
| H10W72/325 | 3 |
| H10W90/736 | 3 |
| H10W74/111 | 3 |
| H10W72/20 | 3 |