Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die
US-12538810-B2 · Jan 27, 2026 · US
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Lim Wee Aun Jason patents
Lim Wee Aun Jason is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lim Wee Aun Jason |
| Total patents | 6 |
| First publication | Feb 25, 2021 |
| Latest publication | Jan 27, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die
US-2024087993-A1 · Mar 14, 2024 · US
Topside-cooled semiconductor package with molded standoff
US-11239127-B2 · Feb 1, 2022 · US
Power semiconductor package and method for fabricating a power semiconductor package
US-11211356-B2 · Dec 28, 2021 · US
Topside-cooled semiconductor package with molded standoff
US-2021398867-A1 · Dec 23, 2021 · US
Power Semiconductor Package and Method for Fabricating a Power Semiconductor Package
US-2021057375-A1 · Feb 25, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 6 |
| H10W70/466 | 6 |
| H10W72/076 | 6 |
| H10W70/481 | 6 |
| H10W72/30 | 4 |