Die alignment method using magnetic force
US-12542228-B2 · Feb 3, 2026 · US
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Lim Kyeongbin patents
Lim Kyeongbin is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lim Kyeongbin |
| Total patents | 24 |
| First publication | Jan 7, 2021 |
| Latest publication | Feb 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Non-contact type gripper
US-12515356-B2 · Jan 6, 2026 · US
Polishing process apparatus
US-2025249545-A1 · Aug 7, 2025 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2025233048-A1 · Jul 17, 2025 · US
Chuck for wafer bonding device
US-2025219011-A1 · Jul 3, 2025 · US
Die bonding apparatus and die bonding method using the same
US-2025140588-A1 · May 1, 2025 · US
Cooling system for semiconductor equipment
US-2025132185-A1 · Apr 24, 2025 · US
Manufacturing method of semiconductor package
US-2025070079-A1 · Feb 27, 2025 · US
Warpage control
US-2025054878-A1 · Feb 13, 2025 · US
Wet atomic layer etching method and method of manufacturing the same
US-2024321805-A1 · Sep 26, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor processing apparatus and method of manufacturing semiconductor device using semiconductor processing apparatus
US-2024282604-A1 · Aug 22, 2024 · US
Die bonding apparatus
US-2024186282-A1 · Jun 6, 2024 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2024170445-A1 · May 23, 2024 · US
Non-contact type gripper
US-2024139972-A1 · May 2, 2024 · US
Substrate bonding method
US-2024145416-A1 · May 2, 2024 · US
Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus
US-11837573-B2 · Dec 5, 2023 · US
Die alignment method using magnetic force
US-2023178280-A1 · Jun 8, 2023 · US
Substrate transfer apparatus
US-2023113869-A1 · Apr 13, 2023 · US
Substrate bonding apparatus
US-11581188-B2 · Feb 14, 2023 · US
Wafer to wafer bonding apparatuses
US-11443965-B2 · Sep 13, 2022 · US
Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus
US-2021398935-A1 · Dec 23, 2021 · US
Wafer to wafer bonding apparatus, wafer to wafer bonding system, and wafer to wafer bonding method
US-2021143030-A1 · May 13, 2021 · US
Substrate bonding apparatus
US-2021104405-A1 · Apr 8, 2021 · US
Wafer to wafer bonding methods and wafer to wafer bonding apparatuses
US-2021005475-A1 · Jan 7, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 23 |
| Knu Lndustry Cooperation Found | 1 |
| Knu Industry Cooperation Found | 1 |
| Samsung Electronics Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/78 | 9 |
| H10W99/00 | 8 |
| H10P72/0428 | 7 |
| H10W72/0711 | 6 |
| H10W72/071 | 6 |