Semiconductor packages and methods of manufacturing the same
US-12412845-B2 · Sep 9, 2025 · US
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Li Jiming patents
Li Jiming is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Li Jiming |
| Total patents | 10 |
| First publication | Aug 6, 2020 |
| Latest publication | Sep 9, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device package and method of manufacturing the same
US-12308306-B2 · May 20, 2025 · US
Semiconductor package structure with dielectric structure covering upper surface of chip
US-11824031-B2 · Nov 21, 2023 · US
Semiconductor device package and method of manufacturing the same
US-2023298985-A1 · Sep 21, 2023 · US
Semiconductor device package and method of manufacturing the same
US-11658102-B2 · May 23, 2023 · US
Semiconductor packages and methods of manufacturing the same
US-2023145588-A1 · May 11, 2023 · US
Semiconductor packages and methods of manufacturing the same
US-11552026-B2 · Jan 10, 2023 · US
Semiconductor package structure
US-2021391291-A1 · Dec 16, 2021 · US
Semiconductor device package and method of manufacturing the same
US-2021225747-A1 · Jul 22, 2021 · US
Semiconductor packages and methods of manufacturing the same
US-2020251421-A1 · Aug 6, 2020 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Advanced Semiconductor Eng | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 8 |
| H10W44/20 | 8 |
| H10W42/276 | 8 |
| H10W42/20 | 8 |
| H10W90/401 | 8 |