High capacity compact lithium thin film battery
US-12506137-B2 · Dec 23, 2025 · US
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Lewandowski Eric Peter patents
Lewandowski Eric Peter is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lewandowski Eric Peter |
| Total patents | 23 |
| First publication | Feb 5, 2015 |
| Latest publication | Dec 23, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Uniform chip gaps via injection-molded solder pillars
US-2024421113-A1 · Dec 19, 2024 · US
Uniform chip gaps via injection-molded solder pillars
US-12107065-B2 · Oct 1, 2024 · US
System and method for forming solder bumps
US-11990437-B2 · May 21, 2024 · US
Selective chemical frequency modification of Josephson junction resonators
US-11895932-B2 · Feb 6, 2024 · US
Hybrid under-bump metallization component
US-11749605-B2 · Sep 5, 2023 · US
Uniform chip gaps via injection-molded solder pillars
US-2022020715-A1 · Jan 20, 2022 · US
Selective chemical frequency modification of josephson junction resonators
US-2021408360-A1 · Dec 30, 2021 · US
Hybrid readout package for quantum multichip bonding
US-11195799-B2 · Dec 7, 2021 · US
Cold-welded flip chip interconnect structure
US-11165010-B2 · Nov 2, 2021 · US
Recent patents
Latest publications not already listed above.
Hybrid readout package for quantum multichip bonding
US-2021305165-A1 · Sep 30, 2021 · US
Sandwich-parallel micro-battery
US-11043690-B2 · Jun 22, 2021 · US
Hybrid under-bump metallization component
US-2021118808-A1 · Apr 22, 2021 · US
High capacity compact lithium thin film battery
US-2021091372-A1 · Mar 25, 2021 · US
Hybrid under-bump metallization component
US-10937735-B2 · Mar 2, 2021 · US
System and method for forming solder bumps
US-2021028138-A1 · Jan 28, 2021 · US
System and method for forming solder bumps
US-10879202-B1 · Dec 29, 2020 · US
Thermalization structure for cryogenic temperature devices
US-10833241-B1 · Nov 10, 2020 · US
Cold-welded flip chip interconnect structure
US-2020259064-A1 · Aug 13, 2020 · US
Sandwich-parallel micro-battery
US-2020212475-A1 · Jul 2, 2020 · US
Hybrid under-bump metallization component
US-2020098695-A1 · Mar 26, 2020 · US
Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release
US-9586291-B2 · Mar 7, 2017 · US
Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release
US-2015035173-A1 · Feb 5, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 22 |
| Globalfoundries Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 14 |
| H10W72/07236 | 12 |
| H10W72/072 | 11 |
| H10N69/00 | 10 |
| H10W72/20 | 10 |