Method and apparatus for detecting tab
US-12524865-B2 · Jan 13, 2026 · US
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Lei Yang patents
Lei Yang is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lei Yang |
| Total patents | 23 |
| First publication | Mar 3, 2016 |
| Latest publication | Jan 13, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device with reduced stress die pick and place
US-12463097-B2 · Nov 4, 2025 · US
Method and device for correcting positions of tabs of electrode assembly
US-12315887-B2 · May 27, 2025 · US
Deviation correction method of electrode sheet, device, apparatus, and storage medium
US-2025074734-A1 · Mar 6, 2025 · US
Method, apparatus, and system for defect detection of separator of composite material strip
US-2025037263-A1 · Jan 30, 2025 · US
Method and apparatus for detecting tab
US-2024420307-A1 · Dec 19, 2024 · US
Method and device for correcting positions of tabs of electrode assembly
US-2024421357-A1 · Dec 19, 2024 · US
Biological valve material, and preparation method therefor and use thereof
US-2024408275-A1 · Dec 12, 2024 · US
Pre-loadable biological heart valve capable of rapid rehydration and preparation method thereof
US-12102733-B2 · Oct 1, 2024 · US
Overhang detection method, apparatus and device for battery electrode sheet, and storage medium
US-12073550-B2 · Aug 27, 2024 · US
Recent patents
Latest publications not already listed above.
Pre-loadable dried biological heart valve and preparation method thereof
US-12064531-B2 · Aug 20, 2024 · US
Detection method and detection apparatus for electrode plate and stacking system
US-2024247931-A1 · Jul 25, 2024 · US
Overhang detection method, apparatus and device for battery electrode sheet, and storage medium
US-2024202904-A1 · Jun 20, 2024 · US
Information processing method and device
US-2024071212-A1 · Feb 29, 2024 · US
Wire bonding for semiconductor devices
US-11901327-B2 · Feb 13, 2024 · US
Apparatus and method for manufacturing electrode assembly
US-2023335801-A1 · Oct 19, 2023 · US
Functionalized biological matrix material, preparation method therefor and use thereof
US-2023077632-A1 · Mar 16, 2023 · US
Semiconductor device with reduced stress die pick and place
US-2022181208-A1 · Jun 9, 2022 · US
Wire Bonding For Semiconductor Devices
US-2022052014-A1 · Feb 17, 2022 · US
Pre-Loadable Biological Heart Valve Capable of Rapid Rehydration and Preparation Method Thereof
US-2021268151-A1 · Sep 2, 2021 · US
Pre-Loadable Dried Biological Heart Valve and Preparation Method Thereof
US-2021260247-A1 · Aug 26, 2021 · US
Dialing method and device
US-9742911-B2 · Aug 22, 2017 · US
Dialing method and device
US-2016065734-A1 · Mar 3, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Contemporary Amperex Technology Hong Kong Ltd | 6 |
| Venus Medtech Hangzhou Inc | 5 |
| Univ Sichuan | 5 |
| Contemporary Amperex Technology Co Ltd | 5 |
| Western Digital Tech Inc | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| Y02E60/10 | 10 |
| H01M10/0404 | 9 |
| H01M10/04 | 7 |
| G06T2207/30108 | 6 |
| A61L2430/20 | 6 |