Wire bonding for semiconductor devices

Patent metadata

Field	Value
Publication number	US-11901327-B2
Application number	US-202117186715-A
Country	US
Kind code	B2
Filing date	Feb 26, 2021
Priority date	Aug 13, 2020
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.

First claim

What is claimed is:

1. A semiconductor device comprising:
an integrated circuit die having a plurality of bond pads; and
a plurality of bond wires, each of the plurality of bond wires being physically connected to a respective one of the plurality of bond pads by a ball bond,
wherein a footprint of each ball bond in an area of contact between each ball bond and the respective bond pad has a shape that is non-circular and includes a first axis of symmetry,
wherein the footprint of each ball bond includes a ball bond width and a ball bond length, and
wherein each of the bond pads includes a bond pad width and a bond pad length, and wherein a ratio of the ball bond length to the ball bond width is equal to a ratio of the bond pad length to the bond pad width ±10%.

2. The semiconductor device of claim 1 , wherein the shape of the footprint of each ball bond in the area of contact includes a second axis of symmetry, wherein the second axis of symmetry is perpendicular to the first axis of symmetry.

3. The semiconductor device of claim 2 , wherein the shape of the footprint of each ball bond in the area of contact includes no more than two axes of symmetry.

4. The semiconductor device of claim 1 , wherein a ratio of the ball bond length to the ball bond width is greater than 1.1.

5. The semiconductor device of claim 4 , wherein the ratio of the ball bond length to the ball bond width is equal to or greater than 2.0.

6. The semiconductor device of claim 4 , wherein the ball bond length is the largest dimension of the shape of the footprint of each ball bond at the area of contact along the first axis of symmetry.

7. The semiconductor device of claim 1 , wherein the ratio of the ball bond length to the ball bond width is equal to the ratio of the bond pad length to the bond pad width ±5%.

8. The semiconductor device of claim 7 , wherein the ratio of the ball bond length to the ball bond width is equal to the ratio of the bond pad length to the bond pad width.

9. The semiconductor device of claim 4 , wherein the footprint of each ball bond in the area of contact is greater than an area of a circle with a diameter equal to the ball bond width.

10. The semiconductor device of claim 1 , wherein the shape of the footprint of each ball bond in the area of contact is selected from the group consisting of a stadium shape, an oval, an ellipse, a rectangle, a rounded rectangle, and a rhombus.

11. The semiconductor device of claim 1 , wherein the shape of the footprint of each ball bond in the area of contact includes only two axes of symmetry.

Assignees

• Western Digital Tech Inc

Inventors

• Lei Yang
• Di Xiaofeng
• Lou Yuyun
• Qian Zhonghua
• Yan Junrong

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/07553

  changes in shapes · CPC title

• H10W72/07511

  Treating the bonding area before connecting, e.g. by applying flux or cleaning · CPC title