Adhesion Enhancing Structures for a Package
US-2020043876-A1 · Feb 6, 2020 · US
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Lee Wei Cheat patents
Lee Wei Cheat is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Wei Cheat |
| Total patents | 1 |
| First publication | Feb 6, 2020 |
| Latest publication | Feb 6, 2020 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/01908 | 1 |
| H10W72/983 | 1 |
| H10W72/981 | 1 |
| H10W72/952 | 1 |
| H10W72/019 | 1 |