Metal routing architecture for integrated circuits
US-9224688-B2 · Dec 29, 2015 · US
Auxiliary members, e.g. spacers
Auxiliary members, e.g. spacers · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/981 |
| Official title | {Auxiliary members, e.g. spacers} |
| Display label | Auxiliary members, e.g. spacers |
| Total patents | 1,305 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 75 |
| 2016 | 101 |
| 2017 | 123 |
| 2018 | 104 |
| 2019 | 95 |
| 2020 | 118 |
| 2021 | 131 |
| 2022 | 150 |
| 2023 | 133 |
| 2024 | 142 |
| 2025 | 115 |
| 2026 | 18 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Compliant interconnects in wafers
US-9224649-B2 · Dec 29, 2015 · US
Via structure for three-dimensional circuit integration
US-9214435-B2 · Dec 15, 2015 · US
Bump Structure and Method of Forming Same
US-2015357301-A1 · Dec 10, 2015 · US
Method for providing a self-aligned pad protection in a semiconductor device
US-2015357234-A1 · Dec 10, 2015 · US
Semiconductor devices and methods of manufacture thereof
US-9209140-B2 · Dec 8, 2015 · US
Semiconductor structrure with composite barrier layer under redistribution layer and manufacturing method thereof
US-2015333021-A1 · Nov 19, 2015 · US
Package substrate and method for fabricating the same
US-2015333029-A1 · Nov 19, 2015 · US
Bond pad having ruthenium directly on passivation sidewall
US-2015333010-A1 · Nov 19, 2015 · US
3d chip-on-wafer-on-substrate structure with via last process
US-2015325520-A1 · Nov 12, 2015 · US
Conductive contacts having varying widths and method of manufacturing same
US-2015325542-A1 · Nov 12, 2015 · US
3d chip-on-wafer-on-substrate structure with via last process
US-2015325497-A1 · Nov 12, 2015 · US
Chip packaging method and chip package using hydrophobic surface
US-2015311177-A1 · Oct 29, 2015 · US
Semiconductor device and method for manufacturing semiconductor device
US-2015311165-A1 · Oct 29, 2015 · US
Functional element, electronic apparatus and mobile entity
US-2015303153-A1 · Oct 22, 2015 · US
GaN transistor with improved bonding pad structure and method of fabricating the same
US-9165896-B2 · Oct 20, 2015 · US
Integrated fan-out package structures with recesses in molding compound
US-9142432-B2 · Sep 22, 2015 · US
Integrated circuit package
US-2015262920-A1 · Sep 17, 2015 · US
Semiconductor light-emitting element
US-9123864-B2 · Sep 1, 2015 · US
Wafer Bonding Process and Structure
US-2015243611-A1 · Aug 27, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/981?
- CPC H10W72/981 is the Cooperative Patent Classification code for “Auxiliary members, e.g. spacers.”
- How many patents are filed under CPC H10W72/981 (Auxiliary members, e.g. spacers)?
- Our database includes 1,305 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/981 growing?
- Publication counts under this code: 142 in 2024 vs 115 in 2025 (latest complete years).