Alignment testing for tiered semiconductor structure
US-11231453-B2 · Jan 25, 2022 · US
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Lee Mincent patents
Lee Mincent is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Mincent |
| Total patents | 10 |
| First publication | Apr 30, 2015 |
| Latest publication | Jan 25, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Alignment testing for tiered semiconductor structure
US-2020264227-A1 · Aug 20, 2020 · US
Alignment testing for tiered semiconductor structure
US-10641819-B2 · May 5, 2020 · US
Alignment testing for tiered semiconductor structure
US-2019025368-A1 · Jan 24, 2019 · US
Alignment testing for tiered semiconductor structure
US-10073135-B2 · Sep 11, 2018 · US
Integrated fan-out pillar probe system
US-9915699-B2 · Mar 13, 2018 · US
Alignment testing for tiered semiconductor structure
US-2017254849-A1 · Sep 7, 2017 · US
Alignment testing for tiered semiconductor structure
US-9658281-B2 · May 23, 2017 · US
Integrated fan-out pillar probe system
US-2016077147-A1 · Mar 17, 2016 · US
Alignment testing for tiered semiconductor structure
US-2015115986-A1 · Apr 30, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 8 |
| Taiwan Semiconductor Mfg | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01R31/2891 | 10 |
| G01R31/54 | 8 |
| G01R31/66 | 8 |
| G01B7/12 | 8 |
| G01R31/318513 | 8 |