Electrical connector between die pad and z-interconnect for stacked die assemblies
US-9508689-B2 · Nov 29, 2016 · US
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Leal Jeffrey S patents
Leal Jeffrey S is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Leal Jeffrey S |
| Total patents | 8 |
| First publication | Feb 26, 2015 |
| Latest publication | Nov 29, 2016 |
Notable patents
Publications ranked by popularity score, then publication date.
Selective die electrical insulation by additive process
US-9490230-B2 · Nov 8, 2016 · US
Electrical connector between die pad and z-interconnect for stacked die assemblies
US-2016027761-A1 · Jan 28, 2016 · US
Selective die electrical insulation by additive process
US-2016020188-A1 · Jan 21, 2016 · US
EMI shield
US-9196588-B2 · Nov 24, 2015 · US
Electrical connector between die pad and z-interconnect for stacked die assemblies
US-9153517-B2 · Oct 6, 2015 · US
Selective die electrical insulation by additive process
US-9147583-B2 · Sep 29, 2015 · US
Semiconductor Die Having Fine Pitch Electrical Interconnects
US-2015056753-A1 · Feb 26, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Invensas Corp | 8 |
| Leal Jeffrey S | 2 |
| Co Reynaldo | 1 |
| Pangrle Suzette K | 1 |
| Mcgrath Scott | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 8 |
| H10W90/24 | 7 |
| H10W70/093 | 7 |
| H10W90/22 | 7 |
| H10W70/60 | 7 |