Semiconductor package with leadframe interconnection structure
US-11444011-B2 · Sep 13, 2022 · US
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Kucher Andreas patents
Kucher Andreas is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kucher Andreas |
| Total patents | 6 |
| First publication | May 30, 2019 |
| Latest publication | Sep 13, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor Package with Leadframe Interconnection Structure
US-2021066172-A1 · Mar 4, 2021 · US
Semiconductor package with leadframe interconnection structure
US-10872848-B2 · Dec 22, 2020 · US
Semiconductor Package with Leadframe Interconnection Structure
US-2020135626-A1 · Apr 30, 2020 · US
Multi-phase half bridge driver package and methods of manufacture
US-10396018-B2 · Aug 27, 2019 · US
Multi-Phase Half Bridge Driver Package and Methods of Manufacture
US-2019164873-A1 · May 30, 2019 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 6 |
| H10W70/041 | 6 |
| H10W90/811 | 6 |
| H10W70/415 | 6 |
| H01L23/49575 | 6 |