Leadframe and semiconductor device
US-2024421050-A1 · Dec 19, 2024 · US
Leadframe inner leads serving as die pads
Leadframe inner leads serving as die pads · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/415 |
| Official title | {Leadframe inner leads serving as die pads} |
| Display label | Leadframe inner leads serving as die pads |
| Total patents | 936 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 55 |
| 2016 | 52 |
| 2017 | 101 |
| 2018 | 88 |
| 2019 | 88 |
| 2020 | 108 |
| 2021 | 90 |
| 2022 | 96 |
| 2023 | 74 |
| 2024 | 91 |
| 2025 | 82 |
| 2026 | 11 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Vertically packaged integrated circuit
US-9484320-B2 · Nov 1, 2016 · US
Lead frame and power module
US-2016307829-A1 · Oct 20, 2016 · US
Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
US-9257306-B2 · Feb 9, 2016 · US
Bumps bonds formed as metal line interconnects in a semiconductor device
US-2016013121-A1 · Jan 14, 2016 · US
Semiconductor device
US-2015380345-A1 · Dec 31, 2015 · US
Flip chip mmic having mounting stiffener
US-2015380343-A1 · Dec 31, 2015 · US
Semiconductor device assembled using two lead frames
US-9209119-B1 · Dec 8, 2015 · US
Method and system for improved matching for on-chip capacitors
US-9209238-B2 · Dec 8, 2015 · US
Stacked die package with redistribution layer
US-2015340305-A1 · Nov 26, 2015 · US
Pad over interconnect pad structure design
US-9189585-B2 · Nov 17, 2015 · US
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer Between Integrated Circuit Dies
US-2015325501-A1 · Nov 12, 2015 · US
Lead frame with abutment surface
US-9184119-B2 · Nov 10, 2015 · US
Semiconductor device and lead frame used for the same
US-9177900-B2 · Nov 3, 2015 · US
High efficiency module
US-2015303136-A1 · Oct 22, 2015 · US
Semiconductor die package and method for making the same
US-9159656-B2 · Oct 13, 2015 · US
Cavity-down pressure sensor device
US-2015285702-A1 · Oct 8, 2015 · US
Pre-soldered leadless package
US-9153529-B2 · Oct 6, 2015 · US
Lead frame, method for manufacturing lead frame and semiconductor device using same
US-9147646-B2 · Sep 29, 2015 · US
Semiconductor Package with Integrated Die Paddles for Power Stage
US-2015270202-A1 · Sep 24, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/415?
- CPC H10W70/415 is the Cooperative Patent Classification code for “Leadframe inner leads serving as die pads.”
- How many patents are filed under CPC H10W70/415 (Leadframe inner leads serving as die pads)?
- Our database includes 936 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/415 growing?
- Publication counts under this code: 91 in 2024 vs 82 in 2025 (latest complete years).