Chip with a silicon carbide substrate and an electrical contact
US-2025266259-A1 · Aug 21, 2025 · US
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Krivec Stefan patents
Krivec Stefan is listed as an inventor on 39 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Krivec Stefan |
| Total patents | 39 |
| First publication | May 7, 2015 |
| Latest publication | Aug 21, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip with a silicon carbide substrate
US-12327727-B2 · Jun 10, 2025 · US
Chip with a Silicon Carbide Substrate
US-2023420257-A1 · Dec 28, 2023 · US
Semiconductor device and method for forming a semiconductor device
US-11842938-B2 · Dec 12, 2023 · US
Process for producing an electrical contact on a silicon carbide substrate
US-11798807-B2 · Oct 24, 2023 · US
Chip arrangement, chip package, method of forming a chip arrangement, and method of forming a chip package
US-2023274996-A1 · Aug 31, 2023 · US
Semiconductor Device and Method for Forming a Semiconductor Device
US-2022093483-A1 · Mar 24, 2022 · US
Semiconductor device and method for forming a semiconductor device
US-11217500-B2 · Jan 4, 2022 · US
Methods of forming a silicon-insulator layer and semiconductor device having the same
US-11195713-B2 · Dec 7, 2021 · US
Process for Producing an Electrical Contact on a Silicon Carbide Substrate
US-2021265168-A1 · Aug 26, 2021 · US
Recent patents
Latest publications not already listed above.
Electrical contact connection on silicon carbide substrate
US-11043383-B2 · Jun 22, 2021 · US
Method for manufacturing a semiconductor device having a Schottky contact
US-10763339-B2 · Sep 1, 2020 · US
Methods of Forming a Silicon-Insulator Layer and Semiconductor Device Having the Same
US-2019385842-A1 · Dec 19, 2019 · US
Electrical Contact Connection on Silicon Carbide Substrate
US-2019362973-A1 · Nov 28, 2019 · US
Semiconductor Device and Method for Forming a Semiconductor Device
US-2019311966-A1 · Oct 10, 2019 · US
Semiconductor device with non-ohmic contact between SiC and a contact layer containing metal nitride
US-10431698-B2 · Oct 1, 2019 · US
Apparatus for analyzing ion kinetics in dielectrics
US-10393697-B2 · Aug 27, 2019 · US
Semiconductor component, method for processing a substrate and method for producing a semiconductor component
US-10361096-B2 · Jul 23, 2019 · US
Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic Contact Formed Between a Semiconductor Material and an Electrically Conductive Contact Layer
US-2019140111-A1 · May 9, 2019 · US
Methods for manufacturing a semiconductor device having a non-ohmic contact formed between a semiconductor material and an electrically conductive contact layer
US-10199514-B2 · Feb 5, 2019 · US
Semiconductor device having a barrier layer made of amorphous molybdenum nitride and method for producing such a semiconductor device
US-9997459-B2 · Jun 12, 2018 · US
Methods for Manufacturing a Semiconductor Device Having a Non-Ohmic Contact Formed Between a Semiconductor Material and an Electrically Conductive Contact Layer
US-2018158964-A1 · Jun 7, 2018 · US
Method of manufacturing a layer structure having partially sealed pores
US-9929111-B2 · Mar 27, 2018 · US
Semiconductor component, method for processing a substrate and method for producing a semiconductor component
US-2018053663-A1 · Feb 22, 2018 · US
Semiconductor Device and Method for Producing a Semiconductor Device
US-2017243828-A1 · Aug 24, 2017 · US
Method of manufacturing a layer structure having partially sealed pores
US-2017194272-A1 · Jul 6, 2017 · US
Semiconductor device and method for producing the same
US-9685347-B2 · Jun 20, 2017 · US
Semiconductor wafer and method
US-2017170282-A1 · Jun 15, 2017 · US
Semiconductor wafer and method
US-9660037-B1 · May 23, 2017 · US
Method of manufacturing an electronic device having a contact pad with partially sealed pores
US-9620466-B1 · Apr 11, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 30 |
| Infineon Technologies Austria Ag | 8 |
| Infineon Technologies Austria | 1 |
| Krivec Stefan | 1 |
| Schagerl Guenter | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D62/8325 | 25 |
| H01L29/1608 | 21 |
| H10D8/051 | 19 |
| H10W72/923 | 18 |
| H10W72/952 | 17 |