Resin composition and molded article
US-12448514-B2 · Oct 21, 2025 · US
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Kono Hideki patents
Kono Hideki is listed as an inventor on 39 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kono Hideki |
| Total patents | 39 |
| First publication | Jun 11, 2015 |
| Latest publication | Oct 21, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Electrodeposition coating composition, coating, coated article, coated electric wire and printed board
US-2025270727-A1 · Aug 28, 2025 · US
Covered wire and method for producing covered wire
US-2025246338-A1 · Jul 31, 2025 · US
Insulated wire and production method therefor
US-2025210218-A1 · Jun 26, 2025 · US
Insulated wire
US-2025201442-A1 · Jun 19, 2025 · US
Rectangular wire, coil, and thermal shrinkage tube
US-2025140442-A1 · May 1, 2025 · US
Resin composition and moulded article
US-12198834-B2 · Jan 14, 2025 · US
Fluorine-containing resin composition and method for production thereof
US-12180358-B2 · Dec 31, 2024 · US
Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board
US-11939450-B2 · Mar 26, 2024 · US
Resin composition and molded article
US-11739206-B2 · Aug 29, 2023 · US
Recent patents
Latest publications not already listed above.
Insulated electrical wire and resin composition
US-2023260672-A1 · Aug 17, 2023 · US
Composition for three-dimensional shaping and three-dimensional shaped object
US-2023242771-A1 · Aug 3, 2023 · US
Powder composition, coating film, and three-dimensional shaped article
US-2023235182-A1 · Jul 27, 2023 · US
Film, wrapping electric wire coating material, film for flexible printed circuit board, and laminate
US-2023174780-A1 · Jun 8, 2023 · US
Resin composition, molded article, and method for producing molded article
US-2023016062-A1 · Jan 19, 2023 · US
Resin composition and molded body
US-11472953-B2 · Oct 18, 2022 · US
Reinforced polycarbonate resin composition
US-11332614-B2 · May 17, 2022 · US
Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board
US-2022135767-A1 · May 5, 2022 · US
Resin composition including a polycarbonate resin and a fluorine-containing polymer, and molded article
US-11261324-B2 · Mar 1, 2022 · US
Resin composition and molded article
US-2022010131-A1 · Jan 13, 2022 · US
Resin composition and molded article
US-2021332229-A1 · Oct 28, 2021 · US
Fluorine-containing resin composition and method for production thereof
US-2021253841-A1 · Aug 19, 2021 · US
Resin composition
US-2021206970-A1 · Jul 8, 2021 · US
Method for producing modified molded article of fluororesin
US-11021582-B2 · Jun 1, 2021 · US
Modified fluorine-containing copolymer, fluorine resin molded article, and method for manufacturing fluorine resin molded article
US-10731015-B2 · Aug 4, 2020 · US
Reinforced polycarbonate resin composition
US-2020140682-A1 · May 7, 2020 · US
Resin composition and molded body
US-2020123368-A1 · Apr 23, 2020 · US
Resin composition and molded article
US-2020123377-A1 · Apr 23, 2020 · US
Method for producing modified molded article of fluororesin
US-10294339-B2 · May 21, 2019 · US
Method for producing modified molded article of fluororesin
US-2018265654-A1 · Sep 20, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Daikin Ind Ltd | 39 |
| Teijin Ltd | 4 |
| Univ Tsinghua | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08L27/18 | 23 |
| C08L27/12 | 12 |
| C08J2327/18 | 10 |
| C08F214/262 | 9 |
| H01B3/445 | 9 |