Resin composition and molded article

US11739206B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11739206-B2
Application numberUS-201917270700-A
CountryUS
Kind codeB2
Filing dateAug 23, 2019
Priority dateAug 28, 2018
Publication dateAug 29, 2023
Grant dateAug 29, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition comprising a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more, wherein the boron nitride particles have a 90% particle size (D90) of 5.0 μm to 9.0 μm. 2. The resin composition according to claim 1 , wherein the boron nitride particles have a ratio of a proportion (b) of particles having a particle size of 24.6 to 29.4 μm to a proportion (a) of particles having a particle size of 14.6 to 20.6 μm ((b)/(a)) of 1.0 or higher. 3. The resin composition according to claim 1 , wherein the boron nitride particles include particles having a particle size of 14.6 to 20.6 μm in a proportion (a) of 5.0% or less. 4. The resin composition according to claim 1 , wherein the boron nitride particles include particles having a particle size of 24.6 to 29.4 μm in a proportion (b) of 10.0% or less. 5. The resin composition according to claim 1 , wherein the fluororesin is a melt-fabricable fluororesin. 6. The resin composition according to claim 1 , wherein the fluororesin includes at least one selected from the group consisting of a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer, a tetrafluoroethylene/hexafluoropropylene copolymer, and an ethylene/tetrafluoroethylene copolymer. 7. The resin composition according to claim 1 , wherein the resin composition has a thermal conductivity of 1.5 W/m·K or higher. 8. The resin composition according to claim 1 , wherein the resin composition has a tensile strain at break of 1.0% or higher. 9. A molded article obtained by injection molding the resin composition according to claim 1 .

Assignees

Inventors

Classifications

  • C08L27/20Primary

    Homopolymers or copolymers of hexafluoropropene · CPC title

  • characterised by the choice of material · CPC title

  • C08K3/38Primary

    Boron-containing compounds · CPC title

  • Homopolymers or copolymers or tetrafluoroethene · CPC title

  • PTFE, i.e. polytetrafluoroethylene {, e.g. ePTFE, i.e. expanded polytetrafluoroethylene} · CPC title

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What does patent US11739206B2 cover?
A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.
Who is the assignee on this patent?
Daikin Ind Ltd
What technology area does this patent fall under?
Primary CPC classification C08L27/20. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 29 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).