Wafer dies with thermally conducting perimeter regions
US-12568846-B2 · Mar 3, 2026 · US
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Knickerbocker John patents
Knickerbocker John is listed as an inventor on 100 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Knickerbocker John |
| Total patents | 100 |
| First publication | Jun 30, 2015 |
| Latest publication | Mar 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
3d chiplet integration technology
US-2026047484-A1 · Feb 12, 2026 · US
Heat spreading and thermal heat removal structures
US-2026005097-A1 · Jan 1, 2026 · US
Structures with enhanced thermal heat spreading and removal
US-2026005139-A1 · Jan 1, 2026 · US
Orthogonal inductors
US-2026005206-A1 · Jan 1, 2026 · US
Testing device for testing semiconductors and methods of fabrication
US-2025383397-A1 · Dec 18, 2025 · US
S-parameter design in backside power distribution network
US-2025385140-A1 · Dec 18, 2025 · US
Testing device for testing semiconductors
US-2025383398-A1 · Dec 18, 2025 · US
Silicon photonic platform
US-2025372956-A1 · Dec 4, 2025 · US
On-chip optical through-silicon via
US-2025370184-A1 · Dec 4, 2025 · US
Recent patents
Latest publications not already listed above.
Testing structure for semiconductor devices
US-2025372463-A1 · Dec 4, 2025 · US
Heat spreader with redistribution layer
US-2025372476-A1 · Dec 4, 2025 · US
Thermal management structure for memory stacks on logic
US-2025365986-A1 · Nov 27, 2025 · US
Thermal Resistance Extraction for Semiconductor Devices
US-2025349647-A1 · Nov 13, 2025 · US
Heat spreader with pins for the thermal management improvement of chiplets
US-2025266316-A1 · Aug 21, 2025 · US
Chiplet integration structure for thermal management
US-2025246499-A1 · Jul 31, 2025 · US
High bandwidth memory cube
US-2025220926-A1 · Jul 3, 2025 · US
Bidirectional wafer-level light coupling
US-2025199253-A1 · Jun 19, 2025 · US
Semiconductor packaging structure with graphite sheets
US-2025201656-A1 · Jun 19, 2025 · US
Infrared debond damage mitigation by copper fill pattern
US-12300615-B2 · May 13, 2025 · US
Release layer containing semiconductor-on-insulator substrates
US-2025048730-A1 · Feb 6, 2025 · US
Orthogonal bridge packaging technology
US-2025006699-A1 · Jan 2, 2025 · US
Electronic substrate stacking
US-12170252-B2 · Dec 17, 2024 · US
Electrically-insulating and highly thermal conductive sheet for electronic devices
US-2024332121-A1 · Oct 3, 2024 · US
Heat spreader for modified edge cooling
US-2024334616-A1 · Oct 3, 2024 · US
Integrated circuit dies with thermally conducting solder perimeter
US-2024282658-A1 · Aug 22, 2024 · US
Co-package optics assembly
US-2024264392-A1 · Aug 8, 2024 · US
Multi-sensor platform for health monitoring
US-12014816-B2 · Jun 18, 2024 · US
High density interconnection and wiring layers, package structures, and integration methods
US-12015003-B2 · Jun 18, 2024 · US
Wafer dies with thermally conducting perimeter regions
US-2024194555-A1 · Jun 13, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 100 |
| Front Edge Tech Inc | 1 |
| Front Edge Technology Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 41 |
| H10W90/724 | 35 |
| H10W72/072 | 23 |
| H10W74/15 | 22 |
| H10P72/74 | 22 |