Chip package and method of forming a chip package

Patent metadata

Field	Value
Publication number	US-9941181-B2
Application number	US-201715599492-A
Country	US
Kind code	B2
Filing date	May 19, 2017
Priority date	May 20, 2016
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically contacting the chip metal surface, and packaging material including a contact layer being in physical contact with the chip metal surface and/or with the metal contact structure; wherein at least in the contact layer of the packaging material, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less than 10 atomic parts per million.

First claim

What is claimed is:

1. A chip package, comprising:
a chip comprising a chip metal surface;
a metal contact structure electrically contacting the chip metal surface; and
a packaging material comprising a contact layer being in physical contact with the chip metal surface and/or with the metal contact structure;
wherein at least in the contact layer of the packaging material, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less than 10 atomic parts per million.

2. The chip package of claim 1 ,
wherein, in the packaging material as a whole, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less than 10 atomic parts per million.

3. The chip package of claim 1 ,
wherein at least the contact layer comprises a stable compound comprising sulfur, selenium and/or tellurium.

4. The chip package of claim 3 ,
wherein the stable compound is a reaction product of a component of the packaging material with sulfur, selenium and/or tellurium.

5. The chip package of claim 3 ,
wherein the stable compound comprises an oligomer or a polymer.

6. The chip package of claim 4 ,
wherein the component of the packaging material comprises a maleimide, a bismaleimide, a derivative of an amino acid, and/or tetraethyl orthosilicate.

7. The chip package of claim 4 ,
wherein the component comprises a filler material, a coloring material, a catalyst, a flexibilizer, a wax, an adhesion promoter, or a stabilizer, e.g. a UV stabilizer, an oxidation stabilizer, or a temperature decomposition stabilizer, of the packaging material.

8. The chip package of claim 3 ,
wherein the stable compound comprises a first functional group and a second functional group comprising the sulfur, selenium and/or tellurium,
wherein the first functional group has a higher affinity for bonding with the chip metal surface and/or with the metal contact structure than the second functional group.

9. The chip package of claim 8 ,
wherein the first functional group comprises one of an amino, azole, silanol, or carboxyl functional group.

10. A method of forming a chip package, comprising:
electrically contacting a metal contact structure to a chip metal surface of a chip; and
at least partially encapsulating the chip and the metal contact structure with packaging material, thereby forming a contact layer of packaging material, the contact layer being in physical contact with the chip and/or with the metal contact structure,
wherein, in the contact layer, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less than 10 atomic parts per million.

11. The method of claim 10 , further comprising:
adding a component to the packaging material, the component reacting with sulfur, selenium and/or tellurium to form a stable compound comprising sulfur, selenium and/or tellurium.

12. The method of claim 11 ,
wherein the adding the component to the packaging material is executed after the at least partially encapsulating the chip and the metal contact structure with the packaging material.

13. The method of claim 10 , further comprising:
adjusting a pH value of the packaging material to a range between 3 and 6 or to a range between 7 and 10.

Assignees

• Infineon Technologies Ag

Inventors

• Koerner Heinrich
• Bauer Michael
• Engl Reimund
• Huettinger Michael
• Kanert Werner
• Mahler Joachim
• Ruehle Brigitte

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title