Method for manufacturing printed wiring board
US-12513828-B2 · Dec 30, 2025 · US
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Kadowaki Yuji patents
Kadowaki Yuji is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kadowaki Yuji |
| Total patents | 7 |
| First publication | Nov 28, 2019 |
| Latest publication | Dec 30, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing printed wiring board and laminating system used for implementing the method
US-2025331109-A1 · Oct 23, 2025 · US
Method for manufacturing printed wiring board and laminating system used for implementing the method
US-2024188228-A1 · Jun 6, 2024 · US
Method for manufacturing printed wiring board
US-11930601-B2 · Mar 12, 2024 · US
Method for manufacturing printed wiring board and coating system for implementing the method
US-2023019554-A1 · Jan 19, 2023 · US
Method for manufacturing printed wiring board and laminating system used for implementing the method
US-2022304166-A1 · Sep 22, 2022 · US
Printed wiring board and method for manufacturing printed wiring board
US-2019364662-A1 · Nov 28, 2019 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ibiden Co Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K3/108 | 6 |
| H05K3/4602 | 5 |
| H05K3/143 | 5 |
| H05K2203/068 | 5 |
| H05K2203/065 | 5 |