Method for manufacturing printed wiring board

Patent metadata

Field	Value
Publication number	US-12513828-B2
Application number	US-202418441702-A
Country	US
Kind code	B2
Filing date	Feb 14, 2024
Priority date	Mar 16, 2021
Publication date	Dec 30, 2025
Grant date	Dec 30, 2025

Abstract

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

First claim

What is claimed is:

1 . A method for manufacturing a printed wiring board, comprising:
forming a seed layer on a surface of a resin insulating layer; applying a dry film onto the seed layer using a laminating device; cutting the dry film applied onto the seed layer to a predetermined size; applying a pressure and heat to the dry film applied onto the seed layer using a pressure application device; forming a plating resist on the seed layer from the dry film using a photographic technology; forming an electrolytic plating film on part of the seed layer exposed from the plating resist; removing the plating resist from the seed layer; and removing the part of the seed layer exposed from the electrolytic plating film, wherein the laminating device includes a laminating roll device configured to apply the dry film onto the seed layer formed on the surface of the resin insulating layer, the pressure application device is positioned such that the pressure application device applies the heat and pressure to an entire surface of the dry film cut to the predetermined size simultaneously, and the pressure application device includes a pressure application container configured to accommodate the resin insulating layer with the dry film applied onto the seed layer on the surface thereof, a heat source positioned in the pressure application container, and a pressure source positioned in the pressure application container.

2 . The method for manufacturing a printed wiring board according to claim 1 , wherein the heat source includes an upper hot plate positioned above the resin insulating layer with the dry film applied onto the seed layer on the surface thereof, and a lower hot plate positioned below the resin insulating layer with the dry film applied onto the seed layer on the surface thereof.

3 . The method for manufacturing a printed wiring board according to claim 2 , wherein the pressure application device has a spacer inserted between a peripheral edge part of the upper hot plate and a peripheral edge part of the lower hot plate.

4 . The method for manufacturing a printed wiring board according to claim 2 , wherein the pressure source is a pressure application gas.

5 . The method for manufacturing a printed wiring board according to claim 4 , wherein the pressure application device has a spacer inserted between a peripheral edge part of the upper hot plate and a peripheral edge part of the lower hot plate.

6 . The method for manufacturing a printed wiring board according to claim 4 , wherein the pressure application gas is compressed air.

7 . The method for manufacturing a printed wiring board according to claim 1 , wherein the pressure source is a pressure application gas.

8 . The method for manufacturing a printed wiring board according to claim 7 , wherein the pressure application gas is compressed air.

9 . The method for manufacturing a printed wiring board according to claim 7 , wherein the applying of the pressure and heat to the dry film is conducted after the applying of the dry film onto the seed layer.

10 . The method for manufacturing a printed wiring board according to claim 1 , wherein the dry film is cut by a cutter configured to cut the dry film applied onto the seed layer to the predetermined size, and the laminating roll device includes a pair of laminating rolls.

11 . The method for manufacturing a printed wiring board according to claim 1 , wherein the applying of the pressure and heat to the dry film is conducted before the forming of the plating resist.

12 . A method for manufacturing a printed wiring board, comprising:
forming a seed layer on a surface of a resin insulating layer; applying a dry film onto the seed layer using a laminating device; cutting the dry film applied onto the seed layer to a predetermined size; applying a pressure and heat to the dry film applied onto the seed layer using a pressure application device; forming a plating resist on the seed layer from the dry film using a photographic technology; forming an electrolytic plating film on part of the seed layer exposed from the plating resist; removing the plating resist from the seed layer; and removing the part of the seed layer exposed from the electrolytic plating film, wherein the laminating device includes a laminating roll device configured to apply the dry film onto the seed layer formed on the surface of the resin insulating layer, the pressure application device is positioned such that the pressure application device applies the heat and pressure to an entire surface of the dry film cut to the predetermined size simultaneously, and the pressure application device includes a plurality of pressing plates configured to sandwich the resin insulating layer with the dry film applied onto the seed layer on the surface thereof such that the heat and pressure are applied to the dry film via the plurality of pressing plates.

13 . A method for manufacturing a printed wiring board, comprising:
forming a seed layer on a surface of a resin insulating layer; applying a dry film onto the seed layer using a laminating device; cutting the dry film applied onto the seed layer to a predetermined size; applying a pressure and heat to the dry film applied onto the seed layer using a pressure application device; forming a plating resist on the seed layer from the dry film using a photographic technology; forming an electrolytic plating film on part of the seed layer exposed from the plating resist; removing the plating resist from the seed layer; and removing the part of the seed layer exposed from the electrolytic plating film, wherein the laminating device includes a laminating roll device configured to apply the dry film onto the seed layer formed on the surface of the resin insulating layer, the pressure application device is positioned such that the pressure application device applies the heat and pressure to an entire surface of the dry film cut to the predetermined size simultaneously, and the applying of the pressure and heat to the dry film is conducted after the applying of the dry film onto the seed layer.

14 . The method for manufacturing a printed wiring board according to claim 13 , wherein the applying of the pressure and heat to the dry film is conducted before the forming of the plating resist.

15 . The method for manufacturing a printed wiring board according to claim 14 , wherein the pressure application device includes an upper hot plate positioned above the resin insulating layer with the dry film applied onto the seed layer on the surface thereof, and a lower hot plate positioned below the resin insulating layer with the dry film applied onto the seed layer on the surface thereof.

16 . The method for manufacturing a printed wiring board according to claim 13 , wherein the pressure application device includes an upper hot plate positioned above the resin insulating layer with the dry film applied onto the seed layer on the surface thereof, and a lower hot plate positioned below the resin insulating layer with the dry film applied onto the seed layer on the surface thereof.

17 . The method for manufacturing a printed wiring board according to claim 16 , wherein the pressure application device has a spacer inserted between a peripheral edge part of the upper hot plate and a peripheral edge part of the lower hot plate.

18 . The method for manufacturing a printed wiring board according to claim 13 , wherein the pressure application device includes a pressure source comprising a pressure application gas.

Assignees

• Ibiden Co Ltd

Inventors

• Kadowaki Yuji
• Kano Tomomi

Classifications

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title

• H05K3/108 Primary

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• H05K3/143

  Masks therefor (H05K3/048 takes precedence) · CPC title

• H05K2203/068

  Features of the lamination press or of the lamination process, e.g. using special separator sheets · CPC title

• H05K2203/065

  Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB · CPC title