Method for manufacturing printed wiring board

Patent metadata

Field	Value
Publication number	US-11930601-B2
Application number	US-202217679525-A
Country	US
Kind code	B2
Filing date	Feb 24, 2022
Priority date	Mar 16, 2021
Publication date	Mar 12, 2024
Grant date	Mar 12, 2024

Abstract

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

First claim

What is claimed is:

1. A method for manufacturing a printed wiring board, comprising:
forming a seed layer on a surface of a resin insulating layer;
applying a dry film onto the seed layer using a laminating roll device;
cutting the dry film applied onto the seed layer to a predetermined size;
applying a pressure and heat to the dry film applied onto the seed layer;
forming a plating resist on the seed layer from the dry film using a photographic technology;
forming an electrolytic plating film on part of the seed layer exposed from the plating resist;
removing the plating resist from the seed layer; and
removing the part of the seed layer exposed from the electrolytic plating film,
wherein the applying of the pressure and heat to the dry film applied onto the seed layer comprises applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to an entire surface of the dry film cut to the predetermined size simultaneously and that the applying of the pressure and heat to the dry film is conducted after the applying of the dry film onto the seed layer and includes applying the pressure to the dry film via a pressure application gas.

2. The method for manufacturing a printed wiring board according to claim 1 , wherein the applying of the pressure and heat to the dry film is conducted before the forming of the plating resist.

3. The method for manufacturing a printed wiring board according to claim 2 , wherein the applying of the pressure and heat to the dry film includes applying the heat to the dry film via the pressure application gas.

4. The method for manufacturing a printed wiring board according to claim 2 , wherein the applying of the dry film includes forming an intermediate substrate, and the applying of the pressure includes putting the intermediate substrate in a pressure application container and putting the pressure application gas in the pressure application container.

5. The method for manufacturing a printed wiring board according to claim 4 , wherein the applying of the pressure and heat to the dry film includes applying the heat to the dry film via the pressure application gas.

6. The method for manufacturing a printed wiring board according to claim 2 , wherein the pressure application gas is compressed air.

7. The method for manufacturing a printed wiring board according to claim 2 , further comprising:
roughening the surface of the resin insulating layer before the forming of the seed layer.

8. The method for manufacturing a printed wiring board according to claim 7 , wherein the roughening the surface of the resin insulating layer comprises roughening the surface of the resin insulating layer such that an arithmetic mean roughness Ra of the surface of the resin insulating layer after roughening is 0.3 μm or less.

9. The method for manufacturing a printed wiring board according to claim 8 , wherein the applying of the pressure and heat to the dry film includes applying the heat to the dry film via the pressure application gas.

10. The method for manufacturing a printed wiring board according to claim 1 , wherein the applying of the pressure and heat to the dry film includes applying the heat to the dry film via the pressure application gas.

11. The method for manufacturing a printed wiring board according to claim 10 , wherein the applying of the dry film includes forming an intermediate substrate, and the applying of the pressure includes putting the intermediate substrate in a pressure application container and putting the pressure application gas in the pressure application container.

12. The method for manufacturing a printed wiring board according to claim 10 , wherein the pressure application gas is compressed air.

13. The method for manufacturing a printed wiring board according to claim 10 , further comprising:
roughening the surface of the resin insulating layer before the forming of the seed layer.

14. The method for manufacturing a printed wiring board according to claim 13 , wherein the roughening the surface of the resin insulating layer comprises roughening the surface of the resin insulating layer such that an arithmetic mean roughness Ra of the surface of the resin insulating layer after roughening is 0.3 μm or less.

15. The method for manufacturing a printed wiring board according to claim 1 , wherein the applying of the dry film includes forming an intermediate substrate, and the applying of the pressure includes putting the intermediate substrate in a pressure application container and putting the pressure application gas in the pressure application container.

16. The method for manufacturing a printed wiring board according to claim 15 , wherein the applying of the pressure and heat to the dry film includes applying the heat to the dry film via the pressure application gas.

17. The method for manufacturing a printed wiring board according to claim 15 , wherein the pressure application gas is compressed air.

18. The method for manufacturing a printed wiring board according to claim 1 , wherein the pressure application gas is compressed air.

19. The method for manufacturing a printed wiring board according to claim 1 , further comprising:
roughening the surface of the resin insulating layer before the forming of the seed layer.

20. The method for manufacturing a printed wiring board according to claim 19 , wherein the roughening the surface of the resin insulating layer comprises roughening the surface of the resin insulating layer such that an arithmetic mean roughness Ra of the surface of the resin insulating layer after roughening is 0.3 μm or less.

Assignees

• Ibiden Co Ltd

Inventors

• Kadowaki Yuji
• Kano Tomomi

Classifications

• H05K3/4629 Primary

  laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets · CPC title

• H05K3/106

  by photographic methods · CPC title

• H05K3/108 Primary

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• H05K3/143

  Masks therefor (H05K3/048 takes precedence) · CPC title

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title