Method of manufacturing semiconductor package including semiconductor chip having internal and external marks
US-2026101766-A1 · Apr 9, 2026 · US
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Jee Youngkun patents
Jee Youngkun is listed as an inventor on 40 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jee Youngkun |
| Total patents | 40 |
| First publication | Mar 9, 2023 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package and manufacturing method thereof
US-2026018563-A1 · Jan 15, 2026 · US
Semiconductor package and method of manufacturing the same
US-2026013252-A1 · Jan 8, 2026 · US
Semiconductor chip and semiconductor package including bonding layers having alignment marks
US-12489071-B2 · Dec 2, 2025 · US
Semiconductor package
US-2025357452-A1 · Nov 20, 2025 · US
Semiconductor package and manufacturing method of the same
US-2025349781-A1 · Nov 13, 2025 · US
Semiconductor package
US-2025349782-A1 · Nov 13, 2025 · US
Semiconductor package
US-2025349807-A1 · Nov 13, 2025 · US
Semiconductor package
US-2025336742-A1 · Oct 30, 2025 · US
Apparatus for stacking chip
US-2025226354-A1 · Jul 10, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor package and method of manufacturing the semiconductor package
US-2025210594-A1 · Jun 26, 2025 · US
Semiconductor package
US-2025183195-A1 · Jun 5, 2025 · US
Semiconductor chip, semiconductor package, and semiconductor chip manufacturing method
US-2025174555-A1 · May 29, 2025 · US
Semiconductor package including conductive post and method of manufacturing the same
US-2025174541-A1 · May 29, 2025 · US
Semiconductor package
US-2025167178-A1 · May 22, 2025 · US
Semiconductor package with heat dissipation through thermal vias
US-2025157875-A1 · May 15, 2025 · US
Semiconductor package with non-conductive support layer
US-2025125302-A1 · Apr 17, 2025 · US
Semiconductor package having improved thermal characteristics
US-2025125293-A1 · Apr 17, 2025 · US
Semiconductor package and method of manufacturing the same
US-2025105216-A1 · Mar 27, 2025 · US
Semiconductor package
US-2025096066-A1 · Mar 20, 2025 · US
Semiconductor package
US-2025087647-A1 · Mar 13, 2025 · US
Semiconductor chip bonding apparatus and semiconductor package manufacturing apparatus
US-2025087624-A1 · Mar 13, 2025 · US
Semiconductor package
US-2025079403-A1 · Mar 6, 2025 · US
Semiconductor package for increasing bonding reliability
US-2025079365-A1 · Mar 6, 2025 · US
Semiconductor package
US-12218102-B2 · Feb 4, 2025 · US
Semiconductor package
US-2025014974-A1 · Jan 9, 2025 · US
Semiconductor package and method of manufacturing the same
US-2025015042-A1 · Jan 9, 2025 · US
Semiconductor package and method of manufacturing the same
US-2025015063-A1 · Jan 9, 2025 · US
Semiconductor package and manufacturing method thereof
US-2025006582-A1 · Jan 2, 2025 · US
Semiconductor package
US-2025006618-A1 · Jan 2, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 40 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 35 |
| H10W90/722 | 26 |
| H10W90/701 | 24 |
| H10W90/724 | 22 |
| H10W72/90 | 22 |