Replacement contact process
US-12142534-B2 · Nov 12, 2024 · US
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Ingle Nitin patents
Ingle Nitin is listed as an inventor on 61 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ingle Nitin |
| Total patents | 61 |
| First publication | Jan 6, 2015 |
| Latest publication | Nov 12, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Selective removal of silicon-containing materials
US-11437242-B2 · Sep 6, 2022 · US
Chamber conditioning and removal processes
US-11328909-B2 · May 10, 2022 · US
Replacement contact process
US-2021217668-A1 · Jul 15, 2021 · US
Replacement contact process
US-10943834-B2 · Mar 9, 2021 · US
Systems and methods utilizing solid-phase etchants
US-10872778-B2 · Dec 22, 2020 · US
Metal recess for semiconductor structures
US-10861676-B2 · Dec 8, 2020 · US
Metal recess for semiconductor structures
US-10854426-B2 · Dec 1, 2020 · US
Selective cobalt removal for bottom up gapfill
US-10770346-B2 · Sep 8, 2020 · US
Self-limiting selective etching systems and methods
US-10755941-B2 · Aug 25, 2020 · US
Recent patents
Latest publications not already listed above.
Selective removal of silicon-containing materials
US-2020168463-A1 · May 28, 2020 · US
SiN spacer profile patterning
US-10600639-B2 · Mar 24, 2020 · US
Germanium etching systems and methods
US-10593553-B2 · Mar 17, 2020 · US
Gas-phase selective etching systems and methods
US-10573527-B2 · Feb 25, 2020 · US
Systems and methods for anisotropic material breakthrough
US-10566206-B2 · Feb 18, 2020 · US
Self-limiting selective etching systems and methods
US-2020013628-A1 · Jan 9, 2020 · US
Systems and methods utilizing solid-phase etchants
US-2020013632-A1 · Jan 9, 2020 · US
Selective atomic layer etching of semiconductor materials
US-10497573-B2 · Dec 3, 2019 · US
Water-free etching methods
US-10497579-B2 · Dec 3, 2019 · US
Water-free etching methods
US-10468267-B2 · Nov 5, 2019 · US
Gas-phase selective etching systems and methods
US-2019311909-A1 · Oct 10, 2019 · US
Selective atomic layer etching of semiconductor materials
US-2019287808-A1 · Sep 19, 2019 · US
Shaped etch profile with oxidation
US-10403507-B2 · Sep 3, 2019 · US
Metal recess for semiconductor structures
US-2019214230-A1 · Jul 11, 2019 · US
Metal recess for semiconductor structures
US-2019214229-A1 · Jul 11, 2019 · US
Chamber conditioning and removal processes
US-2019198300-A1 · Jun 27, 2019 · US
Selective SiN lateral recess
US-10319603-B2 · Jun 11, 2019 · US
Selective cobalt removal for bottom up gapfill
US-2019122923-A1 · Apr 25, 2019 · US
Selective tungsten removal
US-10256112-B1 · Apr 9, 2019 · US
Germanium etching systems and methods
US-2019043727-A1 · Feb 7, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 61 |
| Ingle Nitin | 3 |
| Zhang Jingchun | 2 |
| Wang Anchuan | 2 |
| Mallick Abhijit Basu | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/242 | 36 |
| H01J37/32357 | 30 |
| H10P50/283 | 28 |
| H10P50/267 | 24 |
| H10P50/266 | 23 |