Germanium etching systems and methods

Patent metadata

Field	Value
Publication number	US-10593553-B2
Application number	US-201816056001-A
Country	US
Kind code	B2
Filing date	Aug 6, 2018
Priority date	Aug 4, 2017
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

Exemplary methods for etching a germanium-containing material may include forming a plasma of a fluorine-containing precursor in a remote plasma region of a semiconductor processing chamber. The methods may include flowing effluents of the fluorine-containing precursor through apertures defined in a chamber component. The apertures may be coated with a catalytic material. The methods may include reducing a concentration of fluorine radicals in the plasma effluents with the catalytic material. The methods may also include delivering the plasma effluents to a processing region of the semiconductor processing chamber. A substrate having an exposed region of a germanium-containing material may be housed within the processing region. The methods may further include etching the germanium-containing material.

First claim

The invention claimed is:

1. A method of etching a germanium-containing material, the method comprising:
flowing plasma effluents through apertures defined in a chamber component, wherein the apertures are coated with a catalytic material;
reducing a concentration of radicals in the plasma effluents with the catalytic material;
delivering the plasma effluents to a processing region of a semiconductor processing chamber, wherein a substrate comprising a germanium-containing material is housed in the processing region; and
etching the germanium-containing material.

2. The method of etching a germanium-containing material of claim 1 , wherein the catalytic material comprises one or more materials including an element selected from the group consisting of nickel, cobalt, vanadium, niobium, tantalum, chromium, manganese, rhenium, iron, ruthenium, osmium, palladium, platinum, rhodium, and iridium.

3. The method of etching a germanium-containing material of claim 1 , wherein the chamber component is maintained at a temperature above about 70° C.

4. The method of etching a germanium-containing material of claim 1 , wherein the substrate is maintained at a temperature below about 30° C.

5. The method of etching a germanium-containing material of claim 1 , wherein the germanium-containing material comprises SiGe, and wherein the plasma effluents are formed from a fluorine-containing precursor.

6. The method of etching a germanium-containing material of claim 1 , wherein the germanium-containing material is a first germanium-containing material, wherein the first germanium-containing material is etched relative to silicon or a second germanium-containing material, and wherein the second germanium-containing material is characterized by a lower germanium concentration than the first germanium-containing material.

7. The method of etching a germanium-containing material of claim 6 , wherein the etching has a selectivity towards the first germanium-containing material relative to the silicon or the second germanium-containing material greater than or about 300:1.

8. The method of etching a germanium-containing material of claim 1 , wherein a pressure within the processing chamber is maintained above about 2 Torr.

9. The method of etching a germanium-containing material of claim 1 , wherein the chamber component comprises a showerhead or an ion suppressor.

10. A method of etching a germanium-containing material, the method comprising:
flowing plasma effluents of a precursor through a chamber component comprising a catalytic material;
catalytically converting at least a portion of radicals in the plasma effluents by the catalytic material;
delivering the plasma effluents to a processing region of a semiconductor processing chamber, wherein a substrate comprising a germanium-containing material is housed in the processing region; and
etching the germanium-containing material.

11. The method of etching a germanium-containing material of claim 10 , wherein the converting comprises forming materials including molecules from radicals on the catalytic material.

12. The method of etching a germanium-containing material of claim 10 , wherein the chamber component comprises one or more of a remote plasma unit delivery tube, a blocker plate, a faceplate, an ion suppressor, or a showerhead.

13. The method of etching a germanium-containing material of claim 10 , wherein the catalytic material comprises one or more materials including an element selected from the group consisting of nickel, cobalt, vanadium, niobium, tantalum, chromium, manganese, rhenium, iron, ruthenium, osmium, palladium, platinum, rhodium, and iridium.

14. The method of etching a germanium-containing material of claim 10 , wherein the chamber component is maintained at a temperature above about 70° C.

15. The method of etching a germanium-containing material of claim 10 , wherein the substrate is maintained at a temperature below about 30° C.

16. The method of etching a germanium-containing material of claim 10 , wherein a pressure within the processing chamber is maintained between about 1 Torr and about 30 Torr.

17. A method of etching a germanium-containing material, the method comprising:
flowing plasma effluents of a precursor through apertures defined in a processing system component, wherein the apertures are coated with a catalytic material, and wherein the processing system component is maintained at a temperature between about 70° C. and about 150° C.;
reducing a concentration of radicals in the plasma effluents with the catalytic material;
delivering the plasma effluents to a processing region of a semiconductor processing chamber, wherein a substrate comprising a germanium-containing material is housed in the processing region, and wherein the substrate is maintained at a temperature below about 30° C.; and
etching the germanium-containing material.

18. The method of etching a germanium-containing material of claim 17 , wherein the catalytic material comprises one or more materials including an element selected from the group consisting of nickel, cobalt, vanadium, niobium, tantalum, chromium, manganese, rhenium, iron, ruthenium, osmium, palladium, platinum, rhodium, and iridium.

19. The method of etching a germanium-containing material of claim 17 , wherein a pressure within the processing chamber is maintained between about 1 Torr and about 30 Torr.

20. The method of etching a germanium-containing material of claim 17 , wherein the chamber component comprises a showerhead or an ion suppressor.

Assignees

• Applied Materials Inc

Inventors

• Korolik Mikhail
• Ingle Nitin
• Kioussis Dimitri

Classifications

• H10P50/242 Primary

  of Group IV materials · CPC title

• H01J37/32477

  characterised by the means for protecting vessels or internal parts, e.g. coatings · CPC title

• C23F4/00

  Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00 · CPC title

• H01J37/32449

  Gas control, e.g. control of the gas flow · CPC title

• H01J37/3244

  Gas supply means · CPC title