CMP slurry composition for polishing copper and copper film polishing method using the same
US-12540256-B2 · Feb 3, 2026 · US
This page is not indexed by search engines while we improve data quality.
Hwang Ja Young patents
Hwang Ja Young is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hwang Ja Young |
| Total patents | 14 |
| First publication | Apr 2, 2015 |
| Latest publication | Feb 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Cmp slurry composition for polishing copper and copper film polishing method using the same
US-2023272242-A1 · Aug 31, 2023 · US
Compound, cmp slurry composition including the same and polishing method using the same
US-2023227695-A1 · Jul 20, 2023 · US
Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same
US-10224303-B2 · Mar 5, 2019 · US
Semiconductor device connected by anisotropic conductive film
US-9865558-B2 · Jan 9, 2018 · US
Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same
US-2017162531-A1 · Jun 8, 2017 · US
Semiconductor device connected by anisotropic conductive film
US-9657196-B2 · May 23, 2017 · US
Semiconductor device connected by anisotropic conductive film
US-9490229-B2 · Nov 8, 2016 · US
Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same
US-9490228-B2 · Nov 8, 2016 · US
Semiconductor device connected by anisotropic conductive film
US-9331044-B2 · May 3, 2016 · US
Recent patents
Latest publications not already listed above.
Semiconductor device connected by anisotropic conductive film
US-2016064349-A1 · Mar 3, 2016 · US
Semiconductor device connected by anisotropic conductive film
US-2015318257-A1 · Nov 5, 2015 · US
Semiconductor device connected by anisotropic conductive film
US-2015123292-A1 · May 7, 2015 · US
Semiconductor device connected by anisotropic conductive film
US-2015091192-A1 · Apr 2, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Sdi Co Ltd | 13 |
| Park Kyoung Soo | 1 |
| Kwon Soon Young | 1 |
| Kim Ji Yeon | 1 |
| Park Young Woo | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/354 | 11 |
| H10W72/352 | 11 |
| H10W72/325 | 11 |
| H10W90/734 | 11 |
| H01L24/29 | 11 |