Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same

Patent metadata

Field	Value
Publication number	US-10224303-B2
Application number	US-201615369929-A
Country	US
Kind code	B2
Filing date	Dec 6, 2016
Priority date	Dec 7, 2015
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

An anisotropic conductive film composition, an anisotropic conductive film prepared using the same, and a connection structure using the same, the anisotropic conductive film including a binder resin; a curable alicyclic epoxy compound; a curable oxetane compound; a quaternary ammonium catalyst; and conductive particles, wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1:

Heat quantity variation rate (%)=[( H 0 −H 1 )/ H 0 ]×100  Equation 1
wherein H 0 is a DSC heat quantity of the anisotropic conductive film, as measured at 25° C. and a time point of 0 hr, and H 1 is a DSC heat quantity of the anisotropic conductive film, as measured after being left at 40° C. for 24 hours.

First claim

What is claimed is:

1. An anisotropic conductive film, comprising:
a binder resin;
a curable alicyclic epoxy compound;
a curable oxetane compound;
a quaternary ammonium catalyst;
an inorganic filler; and
conductive particles,
wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1:
Heat quantity variation rate (%)=[( H 0 −H 1 )/ H 0 ]×100,  Equation 1

wherein H 0 is a DSC heat quantity of the anisotropic conductive film, as measured at 25° C. and a time point of 0 hr, and H 1 is a DSC heat quantity of the anisotropic conductive film, as measured after being left at 40° C. for 24 hours,
wherein a weight ratio of the alicyclic epoxy compound to the oxetane compound is about 1:9 to about 9:1, and
wherein the anisotropic conductive film includes:
about 20 wt % to 60 wt % of the binder resin;
a total of about 10 wt % to about 40 wt % of the curable alicyclic epoxy compound and the curable oxetane compound;
about 1 wt % to about 10 wt % of the quaternary ammonium catalyst;
about 5 wt % to about 30 wt % of the inorganic filler; and
about 1 wt % to about 20 wt % of the conductive particles, based on a total weight of the anisotropic conductive film in terms of solid content.

2. The anisotropic conductive film as claimed in claim 1 , wherein the alicyclic epoxy compound is represented by one of Formulae 1 to 4:

wherein, in Formulae 2 to 4,
n, s, t, u, v, m, and f are each independently an integer of 1 to 50, and
R is an alkyl group, an acetyl group, an alkoxy group, or a carbonyl group.

3. The anisotropic conductive film as claimed in claim 1 , wherein the oxetane compound is a carbon polymer compound containing 1 to 4 oxetane rings per molecule.

4. The anisotropic conductive film as claimed in claim 1 , wherein the quaternary ammonium catalyst is represented by Formula 26:

wherein, in Formula 26,
R 11 , R 12 , R 13 and R 14 are each independently a substituted or unsubstituted C 1 to C 6 alkyl group or a substituted or unsubstituted C 6 to C 20 aryl group, and
M is Cl − , BF 4 − , PF 6 − , N(CF 3 SO 2 ) 2− , CH 3 CO 2 − , CF 3 CO 2 − , CF 3 SO 3 − , HSO 4 − , SO 4 2− , SbF 6 − , or B(C 6 F 5 ) 4 − .

5. The anisotropic conductive film as claimed in claim 4 , wherein M is SbF 6 − or B(C 6 F 5 ) 4 − .

6. The anisotropic conductive film as claimed in claim 1 , wherein the binder resin includes a polyimide resin, a polyamide resin, a phenoxy resin, a polymethacrylate resin, a polyacrylate resin, a polyurethane resin, a polyester resin, a polyester urethane resin, a polyvinyl butyral resin, a styrene-butadiene-styrene (SBS) resin or an epoxylated compound thereof, a styrene-ethylene/butylene-styrene (SEBS) resin or a modified compound thereof, an acrylonitrile butadiene rubber (NBR) or a hydrogenated compound thereof, or a combination thereof.

7. The anisotropic conductive film as claimed in claim 6 , wherein the binder resin includes the phenoxy resin, the phenoxy resin including a fluorene phenoxy resin.

8. The anisotropic conductive film as claimed in claim 1 , wherein the inorganic filler includes alumina, silica, titania, zirconia, magnesia, ceria, zinc oxide, iron oxide, silicon nitride, titanium nitride, boron nitride, calcium carbonate, aluminum sulfate, aluminum hydroxide, calcium titanate, talc, calcium silicate, or magnesium silicate.

9. The anisotropic conductive film as claimed in claim 1 , further comprising a stabilizer in an amount of greater than 0 wt % to less than 5 wt %, based on a total weight of the anisotropic conductive film in terms of solid content.

10. The anisotropic conductive film as claimed in claim 1 , further comprising a curable epoxy group-containing silsesquioxane compound, a curable oxetane group-containing silsesquioxane compound, a curable phenol novolac epoxy resin, or a curable cresol novolac epoxy resin.

11. The anisotropic conductive film as claimed in claim 1 , wherein the anisotropic conductive film has a DSC exothermic onset temperature of about 70° C. to about 85° C. and a DSC exothermic peak temperature of about 90° C. to about 110° C.

12. The anisotropic conductive film as claimed in claim 1 , wherein the anisotropic conductive film has a post-reliability connection resistance of about 0.5Ω or less, as measured after preliminary compression at a temperature of 50° C. to 90° C. under a pressure of 0.5 MPa to 2 MPa for 0.5 to 2 seconds and main compression at a temperature of 100° C. to 150° C. under a pressure of 50 MPa to 90 MPa for 4 to 7 seconds, followed by leaving the film at 85° C. and 85% RH for 500 hours.

13. A connection structure, comprising:
a first connection member that includes a first electrode;
a second connection member that includes a second electrode; and
an anisotropic conductive film between the first connection member and the second connection member to connect the first electrode to the second electrode, wherein the anisotropic conductive film is the anisotropic conductive film as claimed in claim 1 .

14. An anisotropic conductive film composition, comprising:
a binder resin;
a curable alicyclic epoxy compound;
a curable oxetane compound;
a quaternary ammonium catalyst;
an inorganic filler; and
conductive particles,
wherein a weight ratio of the alicyclic epoxy compound to the oxetane compound is about 1:9 to about 9:1, and
wherein the anisotropic conductive film includes:
about 20 wt % to 60 wt % of the binder resin;
a total of about 10 wt % to about 40 wt % of the curable alicyclic epoxy compound and the curable oxetane compound;
about 1 wt % to about 10 wt % of the quaternary ammonium catalyst;
about 5 wt % to about 30 wt % of the inorganic filler; and
about 1 wt % to about 20 wt % of the conductive particles, based on a total weight of the anisotropic conductive film in terms of solid content.

15. A connection structure, comprising:
a first connection member that includes a first electrode;
a second connection member that includes a second electrode; and
an anisotropic conductive film between the first connection member and the second connection member to connect the first electrode to the second electrode, wherein the anisotropic conductive film is prepared using the anisotropic conductive film composition as claimed in claim 14 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Ko Youn Jo
• Kwon Soon Young
• Kim Ji Yeon
• Kim Ha Na
• Park Young Woo
• Seo Hyun Joo
• Heo Gun Young
• Hwang Ja Young

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title