Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same

Patent metadata

Field	Value
Publication number	US-9490228-B2
Application number	US-201414229003-A
Country	US
Kind code	B2
Filing date	Mar 28, 2014
Priority date	Mar 29, 2013
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×10 5 /d 2 to 10.0×10 5 /d 2 (particles) per square millimeter (mm 2 ) (where d is a diameter of the conductive particles in μm).

First claim

What is claimed is:

1. An anisotropic conductive film, comprising:
a conductive adhesive layer, which includes conductive particles and insulating particles, and an insulating adhesive layer, which does not include conductive particles,
wherein the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×10 5 /d 2 to 10.0×10 5 /d 2 (particles) per square millimeter (mm 2 ) (where d is a diameter of the conductive particles in μm), and
wherein a volume ratio of the conductive particles to the insulating particles ranges from 1.5:1 to 1:1.5.

2. The anisotropic conductive film as claimed in claim 1 , wherein the conductive particles and the insulating particles are present in an amount of 25 wt % to 60 wt % based on a total weight of the conductive adhesive layer in term of solid content.

3. The anisotropic conductive film as claimed in claim 1 , wherein the conductive particles have a particle diameter (d) of 1 μm to 10 μm.

4. The anisotropic conductive film as claimed in claim 1 , wherein the conductive adhesive layer has a thickness of 50% to 150% of the diameter (d) of the conductive particles.

5. The anisotropic conductive film as claimed claim 1 , wherein the insulating adhesive layer is formed on one or both surfaces of the conductive adhesive layer.

6. An anisotropic conductive film, comprising:
a conductive adhesive layer, which includes conductive particles and insulating particles, and an insulating adhesive layer, which does not include conductive particles,
wherein the conductive particles and the insulating particles of the conductive adhesive layer are present in a total particle area ratio of 80% or more of a total area of the anisotropic conductive film, and
wherein the conductive adhesive layer has a thickness of 50% to 150% of the diameter of the conductive particles.

7. The anisotropic conductive film as claimed in claim 6 , wherein the conductive particles and the insulating particles are present in an amount of 25 wt % to 60 wt % based on a total weight of the conductive adhesive layer in term of solid content.

8. The anisotropic conductive film as claimed in claim 6 , wherein a volume ratio of the conductive particles to the insulating particles ranges from 1.5:1 to 1:3.5.

9. The anisotropic conductive film as claimed in claim 1 , wherein the conductive adhesive layer or the insulating adhesive layer comprises a binder resin and a curing agent.

10. The anisotropic conductive film as claimed in claim 9 , wherein the binder resin is present in an amount of 10 wt % to 60 wt % and the curing agent is present in an amount of 10 wt % to 40 wt %, based on a total weight of the conductive adhesive layer in terms of solid content.

11. The anisotropic conductive film as claimed in claim 9 , wherein the binder resin is present in an amount of 30 wt % to 80 wt % and the curing agent is present in an amount of 20 wt % to 70 wt %, based on a total weight of the insulating adhesive layer in terms of solid content.

12. The anisotropic conductive film as claimed in claim 1 , wherein a thickness ratio of the insulating adhesive layer to the conductive adhesive layer is greater than ⅕ and less than 10.

13. An anisotropic conductive film, comprising:
a conductive adhesive layer, which includes conductive particles and insulating particles, and an insulating adhesive layer, which does not include conductive particles,
wherein the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×10 5 /d 2 to 10.0×10 5 /d 2 (particles) per square millimeter (mm 2 ) (where d is a diameter of the conductive particles in μm), the conductive adhesive layer has a thickness of 50% to 150% of the diameter of the conductive particles, and centers of the conductive particles and the insulating particles are placed substantially on the same plane.

14. A display device, comprising:
a) a wiring substrate;
b) the conductive adhesive layer and the insulating adhesive layer of the anisotropic conductive film as claimed in claim 1 , the anisotropic conductive film being attached to the wiring substrate; and
c) a semiconductor chip mounted on the conductive adhesive layer or the insulating adhesive layer.

15. The anisotropic conductive film as claimed in claim 5 , wherein a thickness ratio of the insulating adhesive layer to the conductive adhesive layer is greater than ⅕ and less than 10.

16. The anisotropic conductive film as claimed in claim 6 , wherein a thickness ratio of the insulating adhesive layer to the conductive adhesive layer is greater than ⅕ and less than 10.

17. A display device, comprising:
a) a wiring substrate;
b) the conductive adhesive layer and the insulating adhesive layer of the anisotropic conductive film as claimed in claim 8 , the anisotropic conductive film being attached to the wiring substrate; and
c) a semiconductor chip mounted on the conductive adhesive layer or the insulating adhesive layer.

Assignees

• Park Kyoung Soo
• Kwon Soon Young
• Kim Ji Yeon
• Park Young Woo
• Han Jae Sun
• Hwang Ja Young
• Cheil Ind Inc

Inventors

• Park Kyoung Soo
• Kwon Soon Young
• Kim Ji Yeon
• Park Young Woo
• Han Jae Sun
• Hwang Ja Young

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/01304

  using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates · CPC title

• H10W72/354

  comprising polymers · CPC title