Module with reversely coupled inductors and magnetic molded compound (MMC)
US-12580122-B2 · Mar 17, 2026 · US
Hou Dongbin is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hou Dongbin |
| Total patents | 16 |
| First publication | Oct 23, 2018 |
| Latest publication | Mar 17, 2026 |
Publications ranked by popularity score, then publication date.
US-12580122-B2 · Mar 17, 2026 · US
US-12580115-B2 · Mar 17, 2026 · US
US-2025218908-A1 · Jul 3, 2025 · US
US-2024428987-A1 · Dec 26, 2024 · US
US-12087498-B2 · Sep 10, 2024 · US
US-2023386731-A1 · Nov 30, 2023 · US
US-2023387817-A1 · Nov 30, 2023 · US
US-2023005652-A1 · Jan 5, 2023 · US
US-2022310302-A1 · Sep 29, 2022 · US
US-11270937-B2 · Mar 8, 2022 · US
Latest publications not already listed above.
US-2021375540-A1 · Dec 2, 2021 · US
US-2021375537-A1 · Dec 2, 2021 · US
US-11094455-B2 · Aug 17, 2021 · US
US-2020211767-A1 · Jul 2, 2020 · US
US-2020211959-A1 · Jul 2, 2020 · US
US-10109404-B2 · Oct 23, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 15 |
| Virginia Tech Intellectual Properties Inc | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01F27/022 | 8 |
| H01F27/24 | 8 |
| H02M3/003 | 6 |
| H01F27/255 | 6 |
| H01F27/346 | 6 |