Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Constructional details, e.g. physical layout, assembly, wiring or busbar connections · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH02M3/003
Official title{Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
Display labelConstructional details, e.g. physical layout, assembly, wiring or busbar connections
Total patents2,286

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is growing.

Patents filed per year
YearPatents
201537
201629
201748
201858
2019107
2020188
2021235
2022295
2023366
2024418
2025399
2026106

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H02M3/003?
CPC H02M3/003 is the Cooperative Patent Classification code for “Constructional details, e.g. physical layout, assembly, wiring or busbar connections.”
How many patents are filed under CPC H02M3/003 (Constructional details, e.g. physical layout, assembly, wiring or busbar connections)?
Our database includes 2,286 publications tagged with this CPC code.
Is patent activity under CPC H02M3/003 growing?
Publication counts under this code: 418 in 2024 vs 399 in 2025 (latest complete years).