Integrated inductor with magnetic mold compound

Patent metadata

Field	Value
Publication number	US-11270937-B2
Application number	US-201816232684-A
Country	US
Kind code	B2
Filing date	Dec 26, 2018
Priority date	Dec 26, 2018
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.

First claim

What is claimed is:

1. An integrated circuit (IC) package, comprising:
a semiconductor die having bond pads;
a leadframe having leads coupled to respective ones of the bond pads;
a first electrically conductive member separate from the leadframe, the electrically conductive member having opposed ends and having a standoff on at least one of the ends, the standoff being coupled to the leadframe;
a magnetic mold compound encapsulating the first electrically conductive member to form a first inductor; and
a second mold compound around the semiconductor die, the leadframe, and the magnetic mold compound.

2. The IC package of claim 1 , in which the first inductor is on a same side of the semiconductor die as the leadframe.

3. The IC package of claim 1 , in which the inductor first electrically conductive member has a shape that is one of spiral or serpentine.

4. The IC package of claim 1 , including a second electrically conductive member encapsulated by the magnetic mold compound to form a second inductor, the second electrically conductive member being separate from the leadframe, having opposed ends, and having a standoff on at least one of the ends, the standoff being coupled to the leadframe.

5. The IC package of claim 4 , in which the first and second inductors have different shapes.

6. The IC package of claim 4 , in which the first inductor is spiral-shaped, and the second inductor is serpentine-shaped.

7. The IC package of claim 1 , in which the first electrically conductive member is coupled to the leadframe via solder balls or conductive pillars.

8. The IC package of claim 1 , in which the leadframe has a first layer and a second layer, the inductor is in the first layer and connects to the second layer, and the second layer electrically connects to the semiconductor die.

9. The IC package of claim 8 , in which the inductor is serpentine-shaped.

10. The IC package of claim 1 , in which the leadframe has a first layer, a second layer, and a third layer, the inductor is formed within the first and second layers, and the third layer connects to the semiconductor die.

11. The IC package of claim 10 , in which the inductor is spiral-shaped.

12. The IC package of claim 1 , in which the magnetic mold compound has a relative permeability of at least 5.

13. An integrated circuit (IC) package, comprising:
a semiconductor die;
a leadframe having leads coupled to bond pads on the semiconductor die;
first and second inductors including respective first and second electrically conductive members coupled to the leadframe and encapsulated in a magnetic mold compound, each electrically conductive member having opposed ends and having a standoff on at least one of the ends coupled to the leadframe; and
a protective mold compound around the semiconductor die, the leadframe, and the first and second inductors.

14. The IC package of claim 13 , in which the inductors are on a same side of the semiconductor die as the leadframe.

15. The IC package of claim 13 , in which the first inductor is spiral-shaped and the second inductor is serpentine-shaped.

16. The IC package of claim 13 , in which the semiconductor die includes a voltage-regulator circuit electrically coupled to the inductors.

17. The IC package of claim 13 , in which the protective mold compound is not magnetic.

18. The IC package of claim 1 , in which the first electrically conductive member has a spiral shaped portion with first and second ends, the first end of the spiral shaped portion is one end of the electrically conductive member and includes a first standoff coupled to the leadframe, the first electrically conductive member includes a conductive bridge extending from the second end of the spiral shaped member to a second standoff coupled to the leadframe at the other end of the electrically conductive member.

19. The IC package of claim 1 , in which the second mold compound is a non-magnetic mold compound.

Assignees

• Texas Instruments Inc

Inventors

• Hou Dongbin
• Kummerl Steven Alfred
• Massolini Roberto Giampiero
• Mullenix Joyce Marie

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H10W74/016

  using moulds · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W70/465

  Bumps or wires · CPC title

• H10W70/451

  Multilayered leadframes · CPC title