Integrated inductor with magnetic mold compound

Patent metadata

Field	Value
Publication number	US-2020211959-A1
Application number	US-201816232684-A
Country	US
Kind code	A1
Filing date	Dec 26, 2018
Priority date	Dec 26, 2018
Publication date	Jul 2, 2020
Grant date	—

Abstract

An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.

First claim

What is claimed is:

1 . An integrated circuit (IC) package, comprising:
a semiconductor die having bond pads; a leadframe comprising a plurality of leads coupled to bond pads coupled to respect ones of the bond pads; an electrically conductive member coupled to the leadframe; a magnetic mold compound encapsulating the electrically conductive member to form an inductor; a non-magnetic mold compound encapsulating the semiconductor die, the leadframe, and the magnetic mold compound.

2 . The IC package of claim 1 , wherein the inductor is on a same side of the semiconductor die as the leadframe.

3 . The IC package of claim 1 , wherein the inductor has a shape that is one of spiral or serpentine.

4 . The IC package of claim 1 , wherein the inductor is a first inductor, and the IC device further comprises a second electrically conductive member encapsulated by the magnetic mold compound to form a second inductor.

5 . The IC package of claim 4 , wherein the first and second inductors have different shapes.

6 . The IC package of claim 4 , wherein the first inductor is spiral-shaped, and the second inductor is serpentine-shaped.

7 . The IC package of claim 1 , wherein the electrically conductive member is coupled to the leadframe via solder balls or conductive pillars.

8 . The IC package of claim 1 , wherein the leadframe has a first layer and a second layer, the inductor is in the first layer and connects to the second layer, and the second layer electrically connects to the semiconductor die.

9 . The IC package of claim 8 , wherein the inductor is serpentine-shaped.

10 . The IC package of claim 1 , wherein the leadframe has a first layer, a second layer, and a third layer, the inductor is formed within the first and second layers, and the third layer connects to the semiconductor die.

11 . The IC package of claim 10 , wherein the inductor is spiral-shaped.

12 . The IC package of claim 1 , wherein the electrically conductive member includes:
a straight member having opposing first and second ends; a first standoff member at the first end; a second standoff member at the second end; and the magnetic mold compound fills space adjacent the substantially straight member formed by the first and second standoffs.

13 . The IC package of claim 1 , wherein the magnetic mold compound has a relative permeability of at least 5.

14 . An integrated circuit (IC) package, comprising:
a semiconductor die; a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die; at least first and second inductors comprising respective first and second electrically conductive members coupled to the leadframe and encapsulated in a magnetic mold compound; and a protective mold compound encapsulating the semiconductor die, the leadframe, and the first and second inductors.

15 . The IC package of claim 14 , wherein the inductors are on a same side of the semiconductor die as the first and second leadframe.

16 . The IC package of claim 14 , wherein the first inductor is spiral-shaped and the second inductor is serpentine-shaped.

17 . The IC package of claim 14 , wherein the semiconductor die includes a voltage-regulator circuit electrically coupled to the inductors.

18 . The IC package of claim 14 , wherein the first and second inductors are parallel to each other.

19 . The IC package of claim 14 , wherein the first electrically conductive member has opposing first and second ends, and the first inductor includes:
a first standoff member at the first end; and a second standoff member at the second end, wherein the magnetic mold compound fills a region formed by the first and second standoffs, the filled region being adjacent the first electrically conductive member.

20 . The IC package of claim 14 , wherein the protective mold compound is not magnetic.

Assignees

• Texas Instruments Inc

Inventors

• Hou Dongbin
• Kummerl Steven Alfred
• Massolini Roberto Giampiero
• Mullenix Joyce Marie

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H10W74/016

  using moulds · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W70/465

  Bumps or wires · CPC title

• H10W70/451

  Multilayered leadframes · CPC title