Blowout preventer system with data playback
US-12535942-B2 · Jan 27, 2026 · US
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Holmes John patents
Holmes John is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Holmes John |
| Total patents | 19 |
| First publication | Oct 12, 2017 |
| Latest publication | Jan 27, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods
US-12512412-B2 · Dec 30, 2025 · US
Re-identifying pseudonymized or de-identified data utilizing distributed ledger technology
US-12216791-B2 · Feb 4, 2025 · US
Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (ic) packages and fabrication methods
US-2024355747-A1 · Oct 24, 2024 · US
Methods and systems for managing vehicle-grid integration
US-12038726-B2 · Jul 16, 2024 · US
Package comprising a chiplet located between an integrated device and a metallization portion
US-2024072032-A1 · Feb 29, 2024 · US
Package comprising a chiplet located between two metallization portions
US-2024071993-A1 · Feb 29, 2024 · US
Safety integrity level rated controls for all-electric bop
US-2023142840-A1 · May 11, 2023 · US
Methods and systems for managing vehicle-grid integration
US-2023046454-A1 · Feb 16, 2023 · US
Flip-chip device
US-11417622-B2 · Aug 16, 2022 · US
Recent patents
Latest publications not already listed above.
Package comprising a substrate configured as a heat spreader
US-11404343-B2 · Aug 2, 2022 · US
Shared power generation to improve electric grid system reliability
US-11368020-B2 · Jun 21, 2022 · US
Blowout preventer system with data playback
US-2022011930-A1 · Jan 13, 2022 · US
Re-Identifying Pseudonymized or De-Identified Data Utilizing Distributed Ledger Technology
US-2021264054-A1 · Aug 26, 2021 · US
Package comprising a substrate configured as a heat spreader
US-2021249325-A1 · Aug 12, 2021 · US
Flip-chip device
US-2021118834-A1 · Apr 22, 2021 · US
Shared power generation to improve electric grid system reliability
US-2020176985-A1 · Jun 4, 2020 · US
Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer
US-10002857-B2 · Jun 19, 2018 · US
PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERIAL (TIM) IN CAVITY OF AN ENCAPSULATION LAYER
US-2017294422-A1 · Oct 12, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 10 |
| Honda Motor Co Ltd | 2 |
| Hydril Usa Distrib Llc | 2 |
| Univ California | 2 |
| Forcepoint Llc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 9 |
| H10W70/685 | 8 |
| H10W72/072 | 7 |
| H10W74/117 | 7 |
| H10W74/15 | 6 |