Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer
US-11963308-B2 · Apr 16, 2024 · US
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Hahn Aaron patents
Hahn Aaron is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hahn Aaron |
| Total patents | 2 |
| First publication | Aug 12, 2021 |
| Latest publication | Apr 16, 2024 |
Notable patents
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Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Atotech Deutschland Gmbh | 2 |
| Atotech Deutschland Gmbh & Co Kg | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K3/385 | 2 |
| C23C22/52 | 2 |
| C23G1/103 | 2 |
| H05K2203/124 | 2 |
| H05K3/282 | 2 |