A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
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Atotech Deutschland Gmbh & Co Kg patents
Atotech Deutschland Gmbh & Co Kg holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 3 |
| First publication | Sep 20, 2022 |
| Latest publication | Jun 6, 2024 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer
US-11963308-B2 · Apr 16, 2024 · US
Method for monitoring the total amount of sulphur containing compounds in a metal plating bath
US-11761090-B2 · Sep 19, 2023 · US
Method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy
US-11447884-B2 · Sep 20, 2022 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer
US-11963308-B2 · Apr 16, 2024 · US
Method for monitoring the total amount of sulphur containing compounds in a metal plating bath
US-11761090-B2 · Sep 19, 2023 · US
Method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy
US-11447884-B2 · Sep 20, 2022 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| C23C18/40 | 2 |
| C23C18/405 | 2 |
| C25D9/08 | 1 |
| C25D3/06 | 1 |
| H05K3/385 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Chemistry & Metallurgy | 4 |
| Electricity | 2 |
| Operations & Transport | 1 |
| Physics | 1 |